生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | ROHS COMPLIANT, SOP-36 | 针数: | 36 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 18 weeks |
风险等级: | 5.66 | Is Samacsys: | N |
标称带宽: | 22 kHz | 商用集成电路类型: | AUDIO AMPLIFIER |
谐波失真: | 10% | JESD-30 代码: | R-PDSO-G36 |
JESD-609代码: | e3 | 长度: | 15.9 mm |
湿度敏感等级: | 3 | 信道数量: | 2 |
功能数量: | 1 | 端子数量: | 36 |
标称输出功率: | 50 W | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HSSOP | 封装等效代码: | SSOP36,.56 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
峰值回流温度(摄氏度): | 245 | 电源: | 14.4 V |
认证状态: | Not Qualified | 座面最大高度: | 3.43 mm |
子类别: | Audio/Video Amplifiers | 最大压摆率: | 200 mA |
最大供电电压 (Vsup): | 18 V | 最小供电电压 (Vsup): | 8 V |
表面贴装: | YES | 技术: | BCDMOS |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 11 mm |
Base Number Matches: | 1 |
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