DATA SHEET
www.onsemi.com
Zener Diode Voltage
Regulators
250 mW Wettable Flank
1
2
Cathode
Anode
NZ8F Series
This series of Zener diodes is packaged in a X2DFNW2 surface
mount package with an industry standard size of 0402 in. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand held portables,
and automotive control units.
MARKING
DIAGRAM
X2DFNW2
CASE 711BG
XXM
XX = Specific Device Code
= Date Code
M
Specification Features
• Zener Breakdown Voltage Range −2.4 V to 47 V
♦ Standard Tolerance Series − NZ8FxxxMX2WT5G
♦ Tight Tolerance Series − NZ8FxxxSMX2WT5G
ORDERING INFORMATION
• Low Body Height: 0.016″ (0.40 mm)
Device
Package
Shipping†
• Wettable Flank Package for optimal Automated Optical Inspection
NZ8FxxxMX2WT5G,
SZNZ8FxxxMX2WT5G
X2DFNW2 8000 / Tape
(Pb−Free) & Reel
(AOI)
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NZ8FxxxSMX2WT5G,
SZNZ8FxxxSMX2WT5G
X2DFNW2 8000 / Tape
(Pb−Free)
& Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of this
data sheet.
(Note 1) @ T = 25°C
250
1.5
mW
A
Derate above 25°C
mW/°C
Total Device Dissipation FR−5 Board,
P
D
(Note 2) @ T = 25°C
500
1.2
mW
mW/°C
A
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
(Note 1)
(Note 2)
R
415
247
°C/W
q
JA
Non−Repetitive Peak Reverse Power (Note 3)
P
ZSM
40
W
Junction and Storage Temperature Range
T , T
−65 to
+150
°C
J
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 Minimum Pad, 1 oz. Cu.
2
2. FR−4 150 mm , 1 oz. Cu.
3. T = 25°C, t = 100 ms.
A
p
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
September, 2021 − Rev. 1
NZ8F2V4MX2W/D