是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | BGA | 包装说明: | LFBGA, BGA64,8X8,20 |
针数: | 64 | Reach Compliance Code: | compliant |
风险等级: | 5.8 | 具有ADC: | YES |
地址总线宽度: | 位大小: | 32 | |
CPU系列: | CORTEX-M3 | 最大时钟频率: | 16 MHz |
DMA 通道: | YES | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B64 | 长度: | 4.466 mm |
端子数量: | 64 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装等效代码: | BGA64,8X8,20 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 2.5/3.3 V |
认证状态: | Not Qualified | RAM(字节): | 65536 |
ROM(单词): | 524288 | ROM可编程性: | FLASH |
速度: | 72 MHz | 子类别: | Microcontrollers |
最大压摆率: | 69 mA | 最大供电电压: | 3.6 V |
最小供电电压: | 2.4 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
宽度: | 4.395 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
STM32F103REY7TR | STMICROELECTRONICS | High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 t |
获取价格 |
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STM32F103REY7XXX | STMICROELECTRONICS | High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 t |
获取价格 |
|
STM32F103REY7XXXTR | STMICROELECTRONICS | IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,CMOS,BGA,64PIN,PLASTIC |
获取价格 |
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STM32F103RF | STMICROELECTRONICS | XL-density performance line ARM-based 32-bit MCU |
获取价格 |
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STM32F103RFT6XXX | STMICROELECTRONICS | 32-BIT, FLASH, 72MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 0.50 MM PITCH, ROHS COMPLI |
获取价格 |
|
STM32F103RFT6XXXTR | STMICROELECTRONICS | IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,CMOS,QFP,64PIN,PLASTIC |
获取价格 |