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STM32F103RGT6 PDF预览

STM32F103RGT6

更新时间: 2024-02-27 11:33:28
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存通信
页数 文件大小 规格书
120页 2552K
描述
XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

STM32F103RGT6 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:LFQFP, QFP64,.47SQ,20
针数:64Reach Compliance Code:compliant
ECCN代码:3A991.A.2风险等级:1.7
具有ADC:YES地址总线宽度:
位大小:32CPU系列:CORTEX-M3
最大时钟频率:25 MHzDAC 通道:YES
DMA 通道:YES外部数据总线宽度:2
JESD-30 代码:S-PQFP-G64JESD-609代码:e4
长度:10 mm湿度敏感等级:3
I/O 线路数量:51端子数量:64
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP64,.47SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2.5/3.3 V
认证状态:Not QualifiedRAM(字节):98304
ROM(单词):1048576ROM可编程性:FLASH
座面最大高度:1.6 mm速度:72 MHz
子类别:Microcontrollers最大压摆率:68 mA
最大供电电压:3.6 V最小供电电压:2 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:10 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

STM32F103RGT6 数据手册

 浏览型号STM32F103RGT6的Datasheet PDF文件第2页浏览型号STM32F103RGT6的Datasheet PDF文件第3页浏览型号STM32F103RGT6的Datasheet PDF文件第4页浏览型号STM32F103RGT6的Datasheet PDF文件第5页浏览型号STM32F103RGT6的Datasheet PDF文件第6页浏览型号STM32F103RGT6的Datasheet PDF文件第7页 
STM32F103xF  
STM32F103xG  
XL-density performance line ARM-based 32-bit MCU with 768 KB to  
1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces  
Target specification  
Features  
FBGA  
Core: ARM 32-bit Cortex™-M3 CPU with MPU  
LQFP64 10 × 10 mm,  
LQFP100 14 × 14 mm,  
– 72 MHz maximum frequency,  
LFBGA144 10 × 10 mm  
1.25 DMIPS/MHz (Dhrystone 2.1)  
performance at 0 wait state memory  
access  
LQFP144 20 × 20 mm  
Up to 112 fast I/O ports  
– 51/80/112 I/Os, all mappable on 16  
external interrupt vectors and almost all  
5 V-tolerant  
– Single-cycle multiplication and hardware  
division  
Memories  
Up to 17 timers  
– 768 Kbytes to 1 Mbyte of Flash memory  
– 96 Kbytes of SRAM  
– Flexible static memory controller with 4  
Chip Select. Supports Compact Flash,  
SRAM, PSRAM, NOR and NAND memories  
– Up to ten 16-bit timers, each with up to 4  
IC/OC/PWM or pulse counter and  
quadrature (incremental) encoder input  
– 2 × 16-bit motor control PWM timers with  
dead-time generation and emergency stop  
– LCD parallel interface, 8080/6800 modes  
– 2 × watchdog timers (Independent and  
Window)  
Clock, reset and supply management  
– SysTick timer: a 24-bit downcounter  
– 2 × 16-bit basic timers to drive the DAC  
– 2.0 to 3.6 V application supply and I/Os  
– POR, PDR, and programmable voltage  
detector (PVD)  
Up to 13 communication interfaces  
2
– 4-to-16 MHz crystal oscillator  
– Up to 2 × I C interfaces (SMBus/PMBus)  
– Internal 8 MHz factory-trimmed RC  
– Internal 40 kHz RC with calibration  
– 32 kHz oscillator for RTC with calibration  
– Up to 5 USARTs (ISO 7816 interface, LIN,  
IrDA capability, modem control)  
– Up to 3 SPIs (18 Mbit/s), 2 with I S  
interface multiplexed  
– CAN interface (2.0B Active)  
– USB 2.0 full speed interface  
– SDIO interface  
2
Low power  
– Sleep, Stop and Standby modes  
– V  
supply for RTC and backup registers  
BAT  
3 × 12-bit, 1 µs A/D converters (up to 21  
CRC calculation unit, 96-bit unique ID  
channels)  
®
ECOPACK packages  
– Conversion range: 0 to 3.6 V  
Triple-sample and hold capability  
Temperature sensor  
Table 1.  
Device summary  
Part number  
Reference  
2 × 12-bit D/A converters  
STM32F103RF STM32F103VF  
STM32F103ZF  
DMA: 12-channel DMA controller  
STM32F103xF  
STM32F103xG  
– Supported peripherals: timers, ADCs, DAC,  
2
2
SDIO, I Ss, SPIs, I Cs and USARTs  
STM32F103RG STM32F103VG  
STM32F103ZG  
Debug mode  
– Serial wire debug (SWD) & JTAG interfaces  
– Cortex-M3 Embedded Trace Macrocell™  
January 2012  
Doc ID 16554 Rev 3  
1/120  
This is preliminary information on a new product foreseen to be developed. Details are subject to change without notice.  
www.st.com  
1
 

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