Datasheet > SPG1316E-H

SPG1316E-H

更新时间： 2024-01-27 22:45:35

品牌	Logo	应用领域
韩国光电子 - AUK		光电
页数	文件大小	规格书
5页	215K
描述
High Brightness Chip LED

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技术参数
数据手册

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SPG1316E-H 技术参数

生命周期：	Contact Manufacturer	Reach Compliance Code：	unknown
HTS代码：	8541.40.20.00	风险等级：	5.82
光电设备类型：	SINGLE COLOR LED

SPG1316E-H 数据手册

SPG1316E-H

Absolute Maximum Ratings

Characteristic

(Ta=25^oC)

Unit

Symbol

P_D

Rating

Power dissipation

Forward current

I_F

*¹Peak forward current

Operating temperature range

Storage temperature range

*²Soldering temperature

I_FP

-25∼80

-30∼100

℃

T_opr

T_stg

T_sol

℃

240℃ for 10 seconds

*1. Duty ratio = 1/16, Pulse width = 0.1ms

*2. Recommended reflow soldering temperature profile

- Preheating 150℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds

Gradual cooling (Avoid quenching)

Temp (℃)

Peak Temp max. 240℃

max. 10sec

240

Preheating area

150~185℃, 90±30sec

Solder area

220℃, max. 60sec

185

150

max. 3℃/sec

max. -6℃/sec

max. 4℃/sec

Time from 25℃ to Peak Temperature max. 6min

60 150 180

240 Time (sec)

Electrical / Optical Characteristics

(Ta=25^oC)

Characteristic

Symbol

Test Condition

I_F= 5mA

Min Typ Max Unit

Forward voltage

V_F

2.6

3.2

*⁴Luminous intensity

I_V

I_F= 5mA

mcd

Peak wavelength

I_F= 5mA

524

536

λ_P

Spectrum bandwidth

∆

±65

±70

*³Half angle

θ1/2

I_F= 5mA

deg

KSD-O8G011-001

123 4 5

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