是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | 5 X 4 MM, OPLGA-16 | Reach Compliance Code: | unknown |
风险等级: | 5.74 | Is Samacsys: | N |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | R-PBGA-B16 |
JESD-609代码: | e0 | 长度: | 5 mm |
湿度敏感等级: | 4 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 80 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFLGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | COMMERCIAL EXTENDED | 端子面层: | TIN LEAD |
端子形式: | BUTT | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 4 mm | Base Number Matches: | 1 |
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