是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | OPLGA-16 | Reach Compliance Code: | unknown |
风险等级: | 5.76 | 接口集成电路类型: | INTERFACE CIRCUIT |
JESD-30 代码: | R-PBGA-BU16 | JESD-609代码: | e0 |
长度: | 4 mm | 湿度敏感等级: | 4 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 80 °C | 最低工作温度: | -30 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | COMMERCIAL EXTENDED | 端子面层: | TIN LEAD |
端子形式: | BUTT | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.5 mm | Base Number Matches: | 1 |
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