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SP1205R30YLB PDF预览

SP1205R30YLB

更新时间: 2024-09-26 07:56:55
品牌 Logo 应用领域
ABC /
页数 文件大小 规格书
7页 106K
描述
General Purpose Inductor, 0.3uH, 25%, Ferrite-Core, 4949,

SP1205R30YLB 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:4949Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.27Base Number Matches:1

SP1205R30YLB 数据手册

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SPECIFICATION FOR APPROVAL  
PAGE: 1  
REF :  
ABC'S DWG NO.  
PROD.  
NAME  
SP1205□□□□L-□□□  
SHIELDED SMD  
POWER INDUCTOR  
ABC'S ITEM NO.  
Ⅰ﹒MECHANICAL DIMENSIONS:  
B
A : 12.50±0.30  
B : 12.50±0.30  
D : 1.90±0.20  
m/m  
m/m  
m/m  
E : 2.50 nom. m/m  
E1: 2.00 ref.  
E2: 2.00 ref.  
F : 7.50±0.25  
F1: 6.40 ref.  
F2: 5.20 ref.  
H : 10.50 ref.  
I : 4.15 ref.  
J : 3.00 ref.  
K : 13.00 ref.  
M : 4.70 ref.  
N : 4.50 ref.  
P : 7.50 ref.  
P1 : 3.75 ref.  
P2 : 3.75 ref.  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
m/m  
C : R30~1R0 : 5.00 max. m/m  
1R8~7R2 : 5.60 max. m/m  
E1  
E
M
1
2
3
CLIP 3  
I
I
For mounting fixed  
F1  
K
( PCB Pattern )  
Ⅱ﹒SCHEMATIC DIAGRAM:  
1
2
a
c
b
Ⅲ﹒MATERIALS LIST:  
aCoreFerrite ER core  
bCoreFerrite SB core  
cWireUltra-fine rectangular  
Enamelled copper wire  
e
f
Peak Temp245max.  
dClipCu/Sn  
Max. Peak Temp - 5℃:30sec max.  
Max time above 217℃ :60sec~150sec max.  
eAdhesiveEpoxy resin  
fAdhesiveEpoxy resin  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
-(1.0 ~ 5.0)/ sec max.  
+3.0/ sec max.  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
gRemarkProducts comply with RoHS'  
Peak Temperature:  
245  
250  
200  
150  
100  
50  
requirements  
217℃  
60sec~150sec  
60sec max.  
Ⅳ﹒GENERAL SPECIFICATION:  
60sec~120sec  
aTemp. rise40max.  
bStorage temp.-40~ +125℃  
cOperating temp.-40~ +105℃  
dResistance to solder heat245. 10 secs.  
50  
100  
150  
Time ( seconds )  
200  
250  
0
AR-001A  

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