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SCLS560 − JANUARY 2004
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 9 ns
pd
6-mA Output Drive at 5 V
CC
D
D
D
D
D
D
D
Extended Temperature Performance of
−40°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Low Input Current of 1 µA Max
Permit Multiplexing From n Lines to One
Line
D
Perform Parallel-to-Serial Conversion
Enhanced Product-Change Notification
†
Qualification Pedigree
D PACKAGE
(TOP VIEW)
3-State Version of ’HC153
Wide Operating Voltage Range of 2 V to 6 V
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
1OE
B
V
CC
2OE
High-Current Inverting Outputs Drive Up To
15 LSTTL Loads
1C3
1C2
1C1
1C0
1Y
A
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
2C3
2C2
2C1
2C0
2Y
GND
description/ordering information
Each data selector/multiplexer contains inverters and drivers to supply full binary decoding data selection to the
AND-OR gates. Separate output-control inputs are provided for each of the two 4-line sections.
The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but one of the
common outputs disabled (in the high-impedance state), the low impedance of the single enabled output drives
the bus line to a high or low logic level. Each output has its own output-enable (OE) input. The outputs are
disabled when their respective OE is high.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
T
A
PACKAGE
−40°C to 125°C
SOIC − D Tape and reel
SN74HC253QDREP
SHC253QEP
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
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