SMDSWLF.020 2OZ
Datasheet revision 1.6
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Solder Wire SAC305 No-Clean with 2.2% Flux Core 2oz Spool
Product Highlights
No-Clean Water-Washable Synthetic Flux Core
The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble
if you want to remove them. Clean with hot water at 60°C (140°F) minimum.
2.2% flux core
Halogen content: None
RoHS II and REACH compliant
Specifications
Alloy:
Sn96.5/Ag3.0/Cu0.5
0.020” (0.5mm)
No-Clean Water-Washable Synthetic
ROL0
217-220°C (423-428°F)
2 oz spool
Wire Diameter:
Flux Type:
Flux Classification:
Melting Point:
Packaging:
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Visual
Test Requirement
Result
IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
L: No breakthrough
L: No corrosion
L: <0.5%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)
IPC-TM-650: 2.6.3.7
IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Clear and free from precipitation
Compliant
Conflict Minerals Compliance
REACH Compliance
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
Yes
1
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