DATA SHEET • SKY73078-459LF QUADRATURE MODULATOR
Table 5. SKY73078-459LF Electrical Characteristics: LO Input (Note 1)
(VCC = 5 V, TA = 25 °C, Unless Otherwise Noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
GSM850 and EGSM900, FRF = 869 MHz to 960 MHz
LO drive level
Single-ended
–6
0
+6
dBm
dB
LO port return loss
50 Ω single-ended
20
LO frequency (Note 2)
EGSM900 high side LO
GSM850 high side LO
EGSM900 low side LO
GSM850 low side LO
925.2
869.2
725.2
669.2
1159.8
1093.8
959.8
MHz
MHz
MHz
MHz
893.8
LTE Bands XII and XIII, FRF = 728 MHz to 756 MHz
LO drive level
Single-ended
–6
0
+6
dBm
dB
LO port return loss
50 Ω single-ended
20
LO frequency (Note 3)
Band XIII high side LO
Band XII high side LO
Band XIII low side LO
Band XII low side LO
746
728
546
528
956
946
756
746
MHz
MHz
MHz
MHz
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Covers single and multi-carrier operation for GSM850 and EGSM900 bands.
Note 3: Covers single and multi-carrier operation for bands XII and XIII.
Table 6. SKY73078-459LF Electrical Characteristics: Baseband Input (Note 1)
(VCC = 5 V, TA = 25 °C, Unless Otherwise Noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Baseband input DC bias common mode
voltage
VCM
0.5
V
I/Q input amplitude
PP differential, sinusoidal
1.4
V
RMS single-ended
Differential input resistance
5.9
TBD
70
kΩ
pF
Differential input capacitance
I/Q input bandwidth (0.1 dB) (Note 2)
Parallel
MHz
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Assuming a 50 Ω source.
3. Components C104 and C125 are bypass capacitors and
should be placed as close as possible to one of the VCC pins, 3
through 6.
Evaluation Board Description
The SKY73078-459LF Evaluation Board is used to test the
performance of the SKY73078-459LF quadrature modulator. An
assembly drawing for the Evaluation Board is shown in Figure 3
and the layer detail is provided in Figure 4. An Evaluation Board
schematic diagram is provided in Figure 5.
Package Dimensions
Package dimensions for the 24-pin QFN are shown in Figure 6,
and tape and reel dimensions are provided in Figure 7.
Circuit Design Configurations
The following design considerations are critical and must be
followed regardless of final use or configuration:
Package and Handling Information
1. Component C106 is an AC ground and should be placed as
close as possible to pin 9 (LON) of the device.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
2. Components C111 and C121 are bypass capacitors and
should be placed as close as possible to one of the VCC pins,
14 through 18.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201121G • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • April 14, 2011
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