DATA SHEET • SKY65066-360LF LOW NOISE AMPLIFIER
8
o
μ1 –40 C
o
24
22
20
7
μ1 +25 C
o
μ1 +85 C
6
o
μ2 –40 C
5
4
o
μ2 +25 C
o
μ2 +85 C
18
16
3
2
1
0
10 Ω
50 Ω
100 Ω
200 Ω
500 Ω
Removed
14
12
10
0
2
4
6
8
10
12
14
16
18
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
2.70
Frequency (GHz)
Frequency (GHz)
Figure 11. Stability vs Frequency Over Temperature
(PIN = –20 dBm)
Figure 12. Small Signal Gain vs Frequency for Multiple Feedback
Resistor Values
Evaluation Board Description
Package Dimensions
The SKY65066-360LF Evaluation Board is used to test the
performance of the SKY65066-360LF low noise amplifier. An
assembly drawing for the Evaluation Board is shown in Figure 13.
The Evaluation Board schematic diagram is shown in Figure 14.
Table 5 provides the Bill of Materials (BOM) list for Evaluation
Board components.
The PCB layout footprint for the SKY65066-360LF is shown in
Figure 15. Typical case markings are shown in Figure 16.
Package dimensions for the 8-pin QFN are shown in Figure 17,
and tape and reel dimensions are provided in Figure 18.
Package and Handling Information
Input and output trace lengths have been minimized to reduce
losses. All surface mount components are 0402-sized to reduce
component parasitics. The use of 0603 or larger components is
not recommended. Component spacing has also been minimized.
The board is provisioned with two RF connectors and a DC
launch. The RF connector and board loss up to component C1 is
approximately 1 dB at 2500 MHz.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
THE SKY65066-360LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 qC. It can be used for lead or lead-free soldering.
It is very important to place multiple ground vias as close to shunt
components as possible. This ensures proper grounding and
circuit performance.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation, document number 200083.
Board material is 10 mil thick VT47 FR4 with 1 oz. copper
cladding. RF input and output traces are 50 Ω.
Evaluation Board Test Procedure
Step 1: Connect RF test equipment to amplifier input/output SMA
connectors.
Step 2: Connect DC ground.
Step 3: Connect VDD to a +5 V supply with a current limit of
100 mA. Verify that the board draws approximately
75 mA.
Step 4: Apply RF signal or noise source.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
November 12, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201090E
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