SiR186DP
Vishay Siliconix
www.vishay.com
N-Channel 60 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
• TrenchFET® Gen IV power MOSFET
• Very low RDS - Qg figure-of-merit (FOM)
• Tuned for the lowest RDS - Qoss FOM
• 100 % Rg and UIS tested
D
D
7
8
D
6
D
5
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S
2
3
S
4
G
S
1
APPLICATIONS
D
Top View
Bottom View
• Synchronous rectification
• Primary side switch
PRODUCT SUMMARY
VDS (V)
60
• DC/DC converter
G
R
DS(on) max. (Ω) at VGS = 10 V
RDS(on) max. (Ω) at VGS = 7.5 V
DS(on) max. (Ω) at VGS = 6 V
0.0045
0.0054
0.0078
15.5
• Motor drive switch
R
S
Qg typ. (nC)
ID (A)
60 a, g
N-Channel MOSFET
Configuration
Single
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8 Single
SiR186DP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
60
20
60 a
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
T
60 a
Continuous drain current (TJ = 150 °C)
ID
23 b, c
18.4 b, c
150
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
51.8
4.5 b, c
Continuous source-drain diode current
Single pulse avalanche current
Single pulse avalanche energy
IAS
EAS
25
31.25
57
L = 0.1 mH
mJ
W
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
36
Maximum power dissipation
PD
5 b, c
3.2 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
20
MAXIMUM
UNIT
t ≤ 10 s
Steady state
25
2.2
°C/W
Maximum junction-to-case (drain)
1.7
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
g. TC = 25 °C
S17-0669-Rev. A, 15-May-17
Document Number: 75426
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000