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SiHL640S PDF预览

SiHL640S

更新时间: 2024-09-25 01:26:11
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威世 - VISHAY /
页数 文件大小 规格书
9页 994K
描述
Repetitive avalanche rated

SiHL640S 数据手册

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IRL640S, SiHL640S  
www.vishay.com  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
• Surface mount  
VDS (V)  
DS(on) ()  
Qg max. (nC)  
200  
• Available in tape and reel  
• Dynamic dV/dt rating  
R
VGS = 5 V  
0.18  
Available  
Available  
• Repetitive avalanche rated  
• Logic-level gate drive  
66  
9.0  
• RDS(on) specified at VGS = 4 V and 5 V  
• Fast switching  
Q
gs (nC)  
gd (nC)  
Q
38  
• Material categorization: for definitions of  
Configuration  
Single  
compliance please see www.vishay.com/doc?99912  
Note  
This datasheet provides information about parts that are  
RoHS-compliant and / or parts that are non-RoHS-compliant. For  
example, parts with lead (Pb) terminations are not RoHS-compliant.  
Please see the information / tables in this datasheet for details.  
D
*
D2PAK (TO-263)  
G
DESCRIPTION  
Third generation power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
D
G
S
S
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of  
its low internal connection resistance and can dissipate up  
to 2.0 W in a typical surface mount application.  
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
SiHL640S-GE3  
IRL640SPbF  
D2PAK (TO-263)  
D2PAK (TO-263)  
Lead (Pb)-free and Halogen-free  
SiHL640STRL-GE3 a  
IRL640STRLPbF a  
SiHL640STL-E3 a  
SiHL640STRR-GE3 a  
IRL640STRRPbF a  
SiHL640STR-E3 a  
Lead (Pb)-free  
SiHL640S-E3  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
Drain-Source Voltage  
Gate-Source Voltage  
SYMBOL  
LIMIT  
200  
10  
UNIT  
VDS  
V
VGS  
T
C = 25 °C  
17  
11  
Continuous Drain Current  
VGS at 5.0 V  
ID  
TC = 100 °C  
A
Pulsed Drain Current a  
IDM  
68  
Linear Derating Factor  
1.0  
W/°C  
Linear Derating Factor (PCB mount) e  
Single Pulse Avalanche Energy b  
Repetitive Avalanche Current a  
Repetitive Avalanche Energy a  
Maximum Power Dissipation  
0.025  
580  
EAS  
IAR  
mJ  
A
10  
EAR  
13  
mJ  
T
C = 25 °C  
125  
PD  
W
V/ns  
°C  
Maximum Power Dissipation (PCB mount) e  
Peak Diode Recovery dV/dt c  
TA = 25 °C  
3.1  
dV/dt  
5.0  
Operating Junction and Storage Temperature Range  
Soldering Temperature d  
TJ, Tstg  
-55 to +150  
300  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 3.0 mH, Rg = 25 , IAS = 17 A (see fig. 12).  
c. ISD 17 A, dI/dt 150 A/μs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1” square PCB (FR-4 or G-10 material).  
S16-0763-Rev. D, 02-May-16  
Document Number: 91306  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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