IRL640S, SiHL640S
www.vishay.com
Vishay Siliconix
Power MOSFET
FEATURES
PRODUCT SUMMARY
• Surface mount
VDS (V)
DS(on) ()
Qg max. (nC)
200
• Available in tape and reel
• Dynamic dV/dt rating
R
VGS = 5 V
0.18
Available
Available
• Repetitive avalanche rated
• Logic-level gate drive
66
9.0
• RDS(on) specified at VGS = 4 V and 5 V
• Fast switching
Q
gs (nC)
gd (nC)
Q
38
• Material categorization: for definitions of
Configuration
Single
compliance please see www.vishay.com/doc?99912
Note
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
D
*
D2PAK (TO-263)
G
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
D
G
S
S
The D2PAK is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D2PAK is suitable for high current applications because of
its low internal connection resistance and can dissipate up
to 2.0 W in a typical surface mount application.
N-Channel MOSFET
ORDERING INFORMATION
Package
D2PAK (TO-263)
SiHL640S-GE3
IRL640SPbF
D2PAK (TO-263)
D2PAK (TO-263)
Lead (Pb)-free and Halogen-free
SiHL640STRL-GE3 a
IRL640STRLPbF a
SiHL640STL-E3 a
SiHL640STRR-GE3 a
IRL640STRRPbF a
SiHL640STR-E3 a
Lead (Pb)-free
SiHL640S-E3
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
LIMIT
200
10
UNIT
VDS
V
VGS
T
C = 25 °C
17
11
Continuous Drain Current
VGS at 5.0 V
ID
TC = 100 °C
A
Pulsed Drain Current a
IDM
68
Linear Derating Factor
1.0
W/°C
Linear Derating Factor (PCB mount) e
Single Pulse Avalanche Energy b
Repetitive Avalanche Current a
Repetitive Avalanche Energy a
Maximum Power Dissipation
0.025
580
EAS
IAR
mJ
A
10
EAR
13
mJ
T
C = 25 °C
125
PD
W
V/ns
°C
Maximum Power Dissipation (PCB mount) e
Peak Diode Recovery dV/dt c
TA = 25 °C
3.1
dV/dt
5.0
Operating Junction and Storage Temperature Range
Soldering Temperature d
TJ, Tstg
-55 to +150
300
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 3.0 mH, Rg = 25 , IAS = 17 A (see fig. 12).
c. ISD 17 A, dI/dt 150 A/μs, VDD VDS, TJ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1” square PCB (FR-4 or G-10 material).
S16-0763-Rev. D, 02-May-16
Document Number: 91306
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000