Datasheet > SI-3000LSA_11

SI-3000LSA_11

更新时间： 2022-10-22 13:50:45

品牌	Logo	应用领域
三垦 - SANKEN		/
页数	文件大小	规格书
2页	73K
描述
Surface-Mount, Low Current Consumption, Low Dropout Voltage

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数据手册

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SI-3000LSA_11 数据手册

SI-3000LSA Series

■External Dimensions (SOP8)

(Unit : mm)

5.1^±0.4

1.27

+0.1

0.4^±0.1

0.15

–0.05

Pin Assignment

q V^IN

w NC (Leave open)

e V^IN

r VC

t GND

y GND

u V^O

i VO

1.27

0.995max.

Plastic Mold Package Type

Flammability: UL94V-0

Product Mass: Approx. 0.1g

0.10

0.4^±0.1

0.12 M

■Block Diagram

VIN

–

V^IN

TSD

GND

■Typical Connection Diagram

VIN

CO: Output capacitor (22 µF or larger)

C^IN: Input capacitor (10 µF)

CIN

This capacitor is required in the case of an inductive input line or long

VIN

wiring.

GND

Tantalum capacitors are recommended for C^INand CO, particularly at

low temperatures.

* Leave pin 2 open.

■Reference Data

PCB Copper Laminate Area vs. Junction to

Ambient Air Thermal Resistance

Allowable Output Current

(vs. VIN-VOUT Voltage Difference)

V^IN-IO max

150

1.2

1.0

0.8

0.6

0.4

0.2

PCB (glass-epoxy, 40×40mm)

Tj = 120°C (20% derating of 150°C)

140

160mm (40×40) mm

The inner frame stage, on which the PTr is mounted,

is directly connected to the V^OUTpin.

Therefore, enlarging the copper laminate area

around the V^OUTpin is really effective for a heat

radiation.

130

120

110

100

j-a=100°C/W

a=25°C

=85°C

100

1000

5000

)

Copper Laminate Area (mm²

VIN-VOUT Voltage Difference (V)

ICs

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