SI-3000KS

更新时间： 2024-01-07 01:15:27

品牌	Logo	应用领域
三垦 - SANKEN		线性稳压器IC
页数	文件大小	规格书
6页	93K
描述
Surface-Mount Low Current Consumption Low Dropout Voltage Linear Regulator ICs

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技术参数
数据手册

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SI-3000KS 技术参数

生命周期：	Active	零件包装代码：	SFM
包装说明：	PLASTIC, TO-220, 5 PIN	针数：	3
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.84
最大回动电压 1：	0.7 V	JESD-30 代码：	R-PZFM-T5
功能数量：	1	端子数量：	5
工作温度TJ-Max：	100 °C	工作温度TJ-Min：	-20 °C
最大输出电流 1：	3 A	最大输出电压 1：	5 V
最小输出电压 1：	1.2 V	封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR	封装形式：	FLANGE MOUNT
认证状态：	Not Qualified	调节器类型：	ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
表面贴装：	NO	端子形式：	THROUGH-HOLE
端子位置：	ZIG-ZAG

SI-3000KS 数据手册

■SI-3000KS Series

■Example of Solder Pattern Design

Symbol Dimensions (mm)

5.72

1.27±0.15

0.2

GND pattern

β1

β2

0.2 to 0.5

0.2

0.6

0.76

L+β1+β2

(Reference value conforming to EIAJ

Standard ED-7402-1)

*1 The inner frame stage on which a monolithic IC is mounted is

directly connected to the GND pins (pins 5 through 8). By

expanding the area of the copper connected to the GND pins,

the heat radiation can be improved. It is recommended to

design the solder pattern by opening the insulation film of the

solder patterns of pins 5, 6, 7, and 8, on the wide GND

pattern as shown in Figure 1.

Figure 1

■Reference Data

Thermal resistance vs. Copper area

Power dissipation vs. Copper area

Area of PC board : 40×40mm

Tj=100°C Area of PC board : 40×40mm

140

1.2

Ta=25°C

Ta=50°C

Ta=80°C

120

100

0.8

0.6

0.4

0.2

100

1000

100

1000

Copper area (mm²)

• Calculating junction temperature

Measure the temperature TL of the lead of the GND pin (pin 7) by using a thermocouple, and substitute the

measured value into the following expression to calculate the junction temperature.

Tj=PD × θj–L + TL

( θj–L = 22°C/W)

1 234 5 6

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