8-Channel, 12-Bit, Configurable ADC/DAC
with On-Chip Reference, SPI Interface
SGM90509
PACKAGE/ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
MODEL
DESCRIPTION
TSSOP-16
SGM90509
XTS16
XXXXX
SGM90509XTS16G/TR
SGM90509XTSK16G/TR
SGM90509XG/TR
Tape and Reel, 4000
Tape and Reel, 4000
Tape and Reel, 3000
-40℃ to +125℃
-40℃ to +125℃
-40℃ to +125℃
00WSK
XXXXX
SGM90509
TQFN-3×3-16BL
WLCSP-2.05×2.05-16B
90509
XXXXX
XX#XX
MARKING INFORMATION
NOTE: XXXXX = Date Code, Trace Code and Vendor Code. XX#XX = Coordinate Information and Wafer ID Number.
TSSOP-16/TQFN-3×3-16BL
WLCSP-2.05×2.05-16B
Date Code - Year
X X X X X
Trace Code
Vendor Code
Trace Code
Vendor Code
Date Code - Year
X X X X X
XX#XX
Coordinate Information
Wafer ID Number ("A" = 01, "B" = 02, …"Y" = 25)
Coordinate Information
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Voltage Range (with Respect to GND)
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
VDD (1) ................................................................. -0.3V to 6V
VLOGIC (1) ............................................................. -0.3V to 6V
Analog Input Voltage..............................-0.3V to VDD + 0.3V
Digital Input Voltage...........................-0.3V to VLOGIC + 0.3V
Digital Output Voltage........................-0.3V to VLOGIC + 0.3V
VREF........................................................-0.3V to VDD + 0.3V
Package Thermal Resistance
ESD SENSITIVITY CAUTION
TSSOP-16, θJA......................................................... 88℃/W
TQFN-3×3-16BL, θJA................................................ 91℃/W
WLCSP-2.05×2.05-16B, θJA..................................... 97℃/W
Junction Temperature.................................................+150℃
Storage Temperature Range.......................-65℃ to +150℃
Lead Temperature (Soldering, 10s)............................+260℃
ESD Susceptibility
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failureto observe proper handlingand installation procedures
can cause damage. ESD damage can range from subtle
performance degradation tocomplete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
HBM.............................................................................1500V
CDM ..............................................................................500V
NOTE:
DISCLAIMER
SG Micro Corp reserves the right to make any change in
1. VDD is powered up first, and the VDD voltage must be higher
than or equal to the VLOGIC voltage.
circuit design, or specifications without prior notice.
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range....................-40℃ to +125℃
SG Micro Corp
www.sg-micro.com
NOVEMBER 2023
2