Datasheet > SESD0201P

SESD0201P

更新时间： 2024-09-26 01:12:03

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
6页	829K
描述
ChipSESD family of Silicon ESD devices

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SESD0201P 数据手册

CHIPSESD DEVICES

Littelfuse’s ChipSESD family of Silicon ESD devices,

available in EIA-0201 and EIA-0402 sized rectangular SMT

passive component packages, can help protect electronic

circuits against damage from electrostatic discharge

(ESD) events.

The SESD0201P1BN-0400-090, 0201-sized ChipSESD

device’s miniature footprint (0.6mm x 0.3mm x 0.3mm) is

approximately 70% smaller than prior-generation devices.

This offers designers flexibility in space constrained

applications.

The ChipSESD devices are high-capacitance, bi-

directional devices that can be used for low-speed generic

interfaces such as keypads, power buttons, speakers

and microphone ports in a portable electronics. The bi-

directional operation eliminates orientation constraints

and the need for polarity inspections. The surface mount

technology (SMT) passive component package allows the devices to be easily installed onto the printed circuit board

using the standard PCB assembly process. Once soldered onto the boards, the ChipSESD’s solder fillets at the end

terminals can easily be visually inspected.

The ChipSESD devices offer 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level 4 standard

with a surge rating of 2A under 8x20μs pulse.

BENEFITS

APPLICATIONS

• Silicon ESD devices in an EIA-0201 and EIA-0402

sized rectangular SMT passive component package

• Mobile phones and portable electronics

• Digital cameras and camcorders

• Bi-directional operation eliminates orientation

constraints

• Notebooks, set top boxes, motherboards

• USB 2.0 and computer I/O ports

• Standard PCB assembly and rework process

• Applications requiring high ESD performance in a

small package

• ESD protection in space-constrained portable

electronics and mobile handsets

• Helps protect electronic circuits against damage

from ESD

• Assists equipment to pass IEC61000-4-2, level 4 testing

FEATURES

• Input capacitance -4.0pF (typ) & 4.5pF (typ)

• Low leakage current – 1.0μA (max)

• Low working reverse voltage - 6.0V (max)

• Capable of withstanding numerous ESD strikes

• RoHS compliant

• Halogen free

≥

(refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm)

RoHS Compliant, ELV Compliant

Halogen Free

12 3 4 5 6

中文翻译

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与SESD0201P相关器件

型号	品牌	获取价格	描述	数据表
SESD0201P1BN-0400-090	LITTELFUSE	获取价格	ChipSESD family of Silicon ESD devices
SESD0201X1BN-0010-098	MACOM	获取价格	Single-channel Silicon ESD Protection Devices
SESD0201X1BN-0010-098	LITTELFUSE	获取价格	SESD系列超低电容分立TVS为最具挑战性的高速串行接口提供单向和双向ESD保护。该产品
SESD0201X1BN-0015-096	LITTELFUSE	获取价格	Trans Voltage Suppressor Diode,
SESD0201X1UN-0020-090	MACOM	获取价格	Single-channel Silicon ESD Protection Devices
SESD0201X1UN-0020-090	LITTELFUSE	获取价格	SESD系列超低电容分立TVS为最具挑战性的高速串行接口提供单向和双向ESD保护。该产品
SESD0201X1UN-0030-088	LITTELFUSE	获取价格	Trans Voltage Suppressor Diode,
SESD03	SECOS	获取价格	110W Transient Voltage Suppressors Diode
SESD0402P	LITTELFUSE	获取价格	ChipSESD family of Silicon ESD devices
SESD0402P1BN-0450-090	LITTELFUSE	获取价格	Trans Voltage Suppressor Diode,

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