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SES900 PDF预览

SES900

更新时间: 2024-09-25 09:29:11
品牌 Logo 应用领域
恩智浦 - NXP 传感器温度传感器光电二极管双倍数据速率
页数 文件大小 规格书
55页 413K
描述
DDR memory module temp sensor with integrated SPD, 3.3 V

SES900 数据手册

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SE97  
DDR memory module temp sensor with integrated SPD, 3.3 V  
Rev. 07 — 29 January 2010  
Product data sheet  
1. General description  
The NXP Semiconductors SE97 measures temperature from 40 °C to +125 °C with  
JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes  
of EEPROM memory communicating via the I2C-bus/SMBus. It is typically mounted on a  
Dual In-line Memory Module (DIMM) measuring the DRAM temperature in accordance  
with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor  
Component specification and also replacing the Serial Presence Detect (SPD) which is  
used to store memory module and vendor information.  
The SE97 thermal sensor operates over the VDD range of 3.0 V to 3.6 V and the EEPROM  
over the range of 3.0 V to 3.6 V write and 1.7 V to 3.6 V read.  
Placing the Temp Sensor (TS) on a DIMM allows accurate monitoring of the DIMM module  
temperature to better estimate the DRAM case temperature (Tcase) to prevent it from  
exceeding the maximum operating temperature of 85 °C. The chip set throttles the  
memory traffic based on the actual temperatures instead of the calculated worst-case  
temperature or the ambient temperature using a temp sensor mounted on the  
motherboard. There is up to 30 % improvement in thin and light notebooks that are using  
one or two 1 GB SO-DIMM modules. The TS is required on DDR3 RDIMM and RDIMM  
ECC. Future uses of the TS will include more dynamic control over thermal throttling, the  
ability to use the Alarm Window to create multiple temperature zones for dynamic  
throttling and to save processor time by scaling the memory refresh rate.  
The TS consists of a ΔΣ Analog-to-Digital Converter (ADC) that monitors and updates its  
own temperature readings 10 times per second, converts the reading to a digital data, and  
latches them into the data temperature register. User-programmable registers, the  
specification of upper/lower alarm and critical temperature trip points, EVENT output  
control, and temperature shutdown, provide flexibility for DIMM temperature-sensing  
applications.  
When the temperature changes beyond the specified boundary limits, the SE97 outputs  
an EVENT signal using an open-drain output that can be pulled up between 0.9 V and  
3.6 V. The user has the option of setting the EVENT output signal polarity as either an  
active LOW or active HIGH comparator output for thermostat operation, or as a  
temperature event interrupt output for microprocessor-based systems. The EVENT output  
can even be configured as a critical temperature output.  
The EEPROM is designed specifically for DRAM DIMMs SPD. The lower 128 bytes  
(address 00h to 7Fh) can be Permanent Write Protected (PWP) or Reversible Write  
Protected (RWP) by software. This allows DRAM vendor and product information to be  
stored and write protected. The upper 128 bytes (address 80h to FFh) are not write  
protected and can be used for general purpose data storage.  

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