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SA636BS,115 PDF预览

SA636BS,115

更新时间: 2024-01-11 06:40:24
品牌 Logo 应用领域
恩智浦 - NXP 电信电信集成电路
页数 文件大小 规格书
31页 2053K
描述
SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI QFN 20-Pin

SA636BS,115 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQFN-20针数:20
Reach Compliance Code:compliant风险等级:1.65
JESD-30 代码:S-PQCC-N20长度:4 mm
湿度敏感等级:1功能数量:1
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:VQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, VERY THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:1 mm标称供电电压:3 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4 mm
Base Number Matches:1

SA636BS,115 数据手册

 浏览型号SA636BS,115的Datasheet PDF文件第1页浏览型号SA636BS,115的Datasheet PDF文件第3页浏览型号SA636BS,115的Datasheet PDF文件第4页浏览型号SA636BS,115的Datasheet PDF文件第5页浏览型号SA636BS,115的Datasheet PDF文件第6页浏览型号SA636BS,115的Datasheet PDF文件第7页 
SA636  
NXP Semiconductors  
Low voltage high performance mixer FM IF system  
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per  
JESD22-C101  
Latch-up testing is done to JEDEC Standard JESD78 Class II, Level B  
3. Applications  
DECT (Digital European Cordless Telephone)  
Digital cordless telephones  
Digital cellular telephones  
Portable high performance communications receivers  
Single conversion VHF/UHF receivers  
FSK and ASK data receivers  
Wireless LANs  
4. Ordering information  
Table 1.  
Ordering information  
Type number Topside  
mark  
Package  
Name  
Description  
Version  
SA636BS  
636B  
HVQFN20 plastic thermal enhanced very thin quad flat package; no leads;  
SOT917-1  
20 terminals; body 4 4 0.85 mm  
SA636DK/01 SA636DK SSOP20  
plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
SA636  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 7 — 16 June 2016  
2 of 31  
 
 

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