S29WS512P
S29WS256P
S29WS128P
SUPPLEMENT
Figure 4.2 VBH084—84-ball Fine-Pitch Ball Grid Array, 11.6 x 8 mm MCP Compatible Package
0.05
(2X)
C
D1
D
A
e
10
9
8
7
6
5
4
3
2
1
e
7
SE
E1
E
M
L
K
J
H
G
F
E
D
C
B
A
A1 CORNER
A1 CORNER
INDEX MARK
B
SD
7
6
0.05
(2X)
C
10
NXφb
φ 0.08
φ 0.15
M
M
C
C
TOP VIEW
A
B
BOTTOM VIEW
0.10
C
A2
A
0.08
C
C
A1
SEATING PLANE
SIDE VIEW
NOTES:
PACKAGE
JEDEC
VBH 084
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
11.60 mm x 8.00 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
---
MAX
1.00
---
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.18
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
0.76
BODY THICKNESS
BODY SIZE
11.60 BSC.
8.00 BSC.
8.80 BSC.
7.20 BSC.
12
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
10
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
84
φb
0.33
---
0.43
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
(A2-A9, B10-L10,
M2-M9, B1-L1)
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3339 \ 16-038.25b
Note:
BSC is an ANSI standard for Basic Space Centering.
4.3
MCP Look-ahead Connection Diagram
Cypress Inc. provides this standard look-ahead connection diagram that supports
NOR Flash and SRAM densities up to 4 Gigabits
NOR Flash and pSRAM densities up to 4 Gigabits
NOR Flash and pSRAM and data storage densities up to 4 Gigabits
The physical package outline may vary between connection diagrams and densities. The connection diagram for any MCP,
however, is a subset of the pinout.
In some cases, outrigger balls may exist in locations outside the grid shown. These outrigger balls are reserved; do not connect
them to any other signal.
For further information about the MCP look-ahead pinout, refer to the Design-In Scalable Wireless Solutions with Cypress Products
application note (publication number: Design_Scalable_Wireless_AN), available on the web or through a Cypress sales office.
Document Number: 002-01747 Rev. *B
Page 7 of 91
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