S29WS512P
S29WS256P
S29WS128P
SUPPLEMENT
4. Physical Dimensions/Connection Diagrams
This section shows the I/O designations and package specifications for the S29WS-P.
4.1
Related Documents
The following documents contain information relating to the S29WS-P devices. Click on the title or go to www.cypress.com to
download the PDF file, or request a copy from your sales office.
Considerations for X-ray Inspection of Surface-Mounted Flash Integrated Circuits
4.2
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data
integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
Figure 4.1 84-Ball Fine-Pitch Ball Grid Array, 512, 256 & 128 Mb
(Top View, Balls Facing Down, MCP Compatible)
A10
A1
NC
NC
Legend
B4
B5
B6
B7
B8
B9
B2
B3
AVD#
VSS
CLK
RFU
VCC
RFU
RFU
RFU
Reserved for
Future Use
C4
C2
C3
A7
C5
C6
C7
A8
C8
C9
WP#
RFU
ACC
WE#
A11
RFU
D4
D2
A3
D3
A6
D5
D7
D8
D9
D6
Do Not Use
Ground
RFU
RESET#
RFU
A19
A12
A15
E2
A2
E3
A5
E4
E5
E6
E7
A9
E8
E9
A18
RDY
A20
A13
A21
F2
A1
F3
A4
F4
F5
F6
F7
F8
F9
Power
A17
RFU
A23
A10
A14
A22
G2
A0
G3
G4
G5
G6
G7
G8
G9
VSS
DQ1
RFU
RFU
DQ6
A24
A16
H4
H5
H6
H7
H8
H2
H2
H3
DQ9
DQ3
DQ4
DQ13
DQ15
RFU
F-CE#
OE#
J4
J5
J6
J7
J8
J9
J2
J3
DQ12
VSS
RFU
DQ0
DQ10
VCC
RFU
DQ7
K2
K3
K4
K5
K6
K7
K8
K9
DQ2
DQ11
RFU
DQ5
DQ14
RFU
RFU
DQ8
L2
L3
L4
L5
L6
L7
L8
L9
RFU
RFU
RFU
VSS
VCC
RFU
RFU
VCCQ
M1
M10
NC
NC
Notes:
1. Balls F6 and G8 are RFU on the WS128P.
2. Ball G8 is RFU on the WS256P.
3.
V
pins must ramp simultaneously.
CC
Document Number: 002-01747 Rev. *B
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