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S29AL016J70BFN040 PDF预览

S29AL016J70BFN040

更新时间： 2024-02-28 03:09:32
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 内存集成电路
页数 文件大小 规格书
58页 786K
描述
Flash, 1MX16, 70ns, PBGA48, FPBGA-48

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中文翻译

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S29AL016J70BFN040 技术参数

是否Rohs认证： 符合生命周期：Transferred
零件包装代码：BGA包装说明：8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
针数：48Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8542.32.00.51
风险等级：5.18最长访问时间：70 ns
其他特性：BOTTOM BOOT BLOCK备用内存宽度：8
启动块：BOTTOM命令用户界面：YES
数据轮询：YESJESD-30 代码：R-PBGA-B48
JESD-609代码：e1长度：8.15 mm
内存密度：16777216 bit内存集成电路类型：FLASH
内存宽度：16湿度敏感等级：3
功能数量：1部门数/规模：1,2,1,31
端子数量：48字数：1048576 words
字数代码：1000000工作模式：ASYNCHRONOUS
最高工作温度：125 °C最低工作温度：-40 °C
组织：1MX16封装主体材料：PLASTIC/EPOXY
封装代码：VFBGA封装等效代码：BGA48,6X8,32
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行：PARALLEL电源：3/3.3 V
编程电压：3 V认证状态：Not Qualified
就绪/忙碌：YES座面最大高度：1 mm
部门规模：16K,8K,32K,64K最大待机电流：0.000005 A
子类别：Flash Memories最大压摆率：0.03 mA
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：2.7 V
标称供电电压 (Vsup)：3 V表面贴装：YES
技术：CMOS温度等级：AUTOMOTIVE
端子面层：Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
切换位：YES类型：NOR TYPE
宽度：6.15 mmBase Number Matches：1

S29AL016J70BFN040 数据手册

 浏览型号S29AL016J70BFN040的Datasheet PDF文件第2页浏览型号S29AL016J70BFN040的Datasheet PDF文件第3页浏览型号S29AL016J70BFN040的Datasheet PDF文件第4页浏览型号S29AL016J70BFN040的Datasheet PDF文件第5页浏览型号S29AL016J70BFN040的Datasheet PDF文件第6页浏览型号S29AL016J70BFN040的Datasheet PDF文件第7页 
S29AL016J  
16 Mbit (2 M x 8-Bit/1 M x 16-Bit), 3 V  
Boot Sector Flash  
Distinctive Characteristics  
Architectural Advantages  
Performance Characteristics  
Single Power Supply Operation  
High Performance  
– Full voltage range: 2.7 to 3.6 volt read and write operations for  
battery-powered applications  
– Access times as fast as 55 ns  
– Extended temperature range (–40°C to +125°C)  
Ultra Low Power Consumption (typical values at 5 MHz)  
– 0.2 µA Automatic Sleep mode current  
– 0.2 µA standby mode current  
Manufactured on 110 nm Process Technology  
– Fully compatible with 200 nm S29AL016D  
Secured Silicon Sector region  
– 128-word/256-byte sector for permanent, secure identification  
through an 8-word/16-byte random Electronic Serial Number  
accessible through a command sequence  
– 7 mA read current  
– 20 mA program/erase current  
Cycling Endurance: 1,000,000 cycles per sector typical  
Data Retention: 20 years typical  
– May be programmed and locked at the factory or by the customer  
Flexible Sector Architecture  
– One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-one 64 Kbyte  
sectors (byte mode)  
Package Options  
48-ball Fine-pitch BGA  
64-ball Fortified BGA  
48-pin TSOP  
– One 8 Kword, two 4 Kword, one 16 Kword, and thirty-one 32  
Kword sectors (word mode)  
Sector Group Protection Features  
– A hardware method of locking a sector to prevent any program or  
erase operations within that sector  
Software Features  
CFI (Common Flash Interface) Compliant  
– Sectors can be locked in-system or via programming equipment  
– Temporary Sector Unprotect feature allows code changes in  
previously locked sectors  
– Provides device-specific information to the system, allowing host  
software to easily reconfigure for different Flash devices  
Erase Suspend/Erase Resume  
Unlock Bypass Program Command  
– Suspends an erase operation to read data from, or program data  
to, a sector that is not being erased, then resumes the erase  
operation  
– Reduces overall programming time when issuing multiple program  
command sequences  
Top or Bottom Boot Block Configurations Available  
Compatibility with JEDEC standards  
Data# Polling and Toggle Bits  
– Provides a software method of detecting program or erase  
operation completion  
– Pinout and software compatible with single-power supply Flash  
– Superior inadvertent write protection  
Hardware Features  
Ready/Busy# Pin (RY/BY#)  
– Provides a hardware method of detecting program or erase cycle  
completion  
Hardware Reset Pin (RESET#)  
– Hardware method to reset the device to reading array data  
WP# input pin  
– For boot sector devices: at VIL, protects first or last 16 Kbyte  
sector depending on boot configuration (top boot or bottom boot)  
Cypress Semiconductor Corporation  
Document Number: 002-00777 Rev. *L  
•
198 Champion Court  
•
San Jose, CA 95134-1709  
•
408-943-2600  
Revised December 08, 2015  
1234567...58

中文翻译

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与S29AL016J70BFN040相关器件

型号 品牌 获取价格 描述 数据表
S29AL016J70BFN043 SPANSION

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 		Flash, 1MX16, 70ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FPBGA-48
S29AL016J70FAN020 INFINEON

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 		Standard Interface
S29AL016J70FFI010 SPANSION

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 		Flash, 1MX16, 70ns, PBGA64, 9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64
S29AL016J70FFI010 INFINEON

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 		Standard Interface
S29AL016J70FFI012 INFINEON

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 		Standard Interface
S29AL016J70FFI013 SPANSION

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 		Flash, 1MX16, 70ns, PBGA64, 9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64
S29AL016J70FFI020 INFINEON

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 		Standard Interface
S29AL016J70FFI022 SPANSION

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 		Flash, 1MX16, 70ns, PBGA64, 9 X 9 MM, 1 MM PITCH, LEAD FREE, FBGA-64
S29AL016J70FFI022 INFINEON

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 		Standard Interface
S29AL016J70FFI022 CYPRESS

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 		Flash, 1MX16, 70ns, PBGA64, FBGA-64

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