S-7000
ROTARY CODED SWITCHES (SMD)
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STANDARD SPECIFICATIONS
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ELECTRICAL CHARACTERISTICS
BCD (Real code, complementary code)
Circuit type
Contact rating
Non-switching
Switching
Minimum
BCH (Real code, complementary code)
DC50 V 100 mA
DC5 V 100 mA
DC20 mV 1 μA
Operating temperature range
−40 ~ 85 °C
Storage temperature range
Sealing
Contact resistance
Insulation resistance
Dielectric strength
100 mΩ maximum
100 MΩ (DC100 V) minimum
AC250 V, 60 s
Washable by “O” ring
※Please refer to page 150,151
Approx. 0.26 g (A or B type in top setting)
Approx. 0.28 g (C type in top setting)
Approx. 0.62 g (Side setting type)
Net weight
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MECHANICAL CHARACTERISTICS
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ENVIRONMENTAL CHARACTERISTICS
No. of positions
6, 10, 16
(Amplitude) 1.5 mm or
Vibration
(Acceleration) 98 m/s2,
10-500-10 Hz, 3 directions for 2 h each
Adjustment torque
20 mN·m {204 gf·cm} maximum
490 m/s2, 11 ms
60° (6 positions)
36° (10 positions)
22.5° (16 positions)
Shock
6 directions for 3 times each
Stepping angle
Solderability
Load life
10000 steps minimum, DC5 V, 100 mA
40 °C, Relative humidity 90 ~ 95 %, 240 h
85 °C, 96 h
245 ± 3 °C, 2 ~ 3 s
Humidity (Steady state)
High temperature exposure
Low temperature exposure
Thermal shock
Reflow:255 °C (Peak temperature)
(Please refer to the profile below)
Flow : 260 ± ±3 °C, 5 ~ 6 s, two times maximum
Manual soldering : 350 ± 10 °C, 3 ~ 4 s
Soldering heat
−40 °C, 96 h
Shear (adhesion)
Substrate bending
Pull-off strength
5 N {0.51 kgf}, 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf}, 10 s
−40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
{ } : Reference only
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Reflow profile for soldering heat evaluation
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(℃)
Peak : 250 +50 ℃
250
Over 230 ℃
200
150
Pre Heating Zone
180 ℃
150 ℃
90 30 s
100
50
30 10 s
Soldering Zone
Heating time
Reflow : two times maximum