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RT6363 PDF预览

RT6363

更新时间: 2024-04-09 19:02:44
品牌 Logo 应用领域
立锜 - RICHTEK /
页数 文件大小 规格书
35页 650K
描述
60VIN, 3.5A, Asynchronous Step-Down Converter with Low Quiescent Current

RT6363 数据手册

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RT6363  
Functional Pin Description  
Pin No.  
Pin Name  
BOOT  
VIN  
Pin Function  
SOP-8  
WDFN-10L 4x4  
(Exposed Pad)  
Bootstrap capacitor connection node to supply the high-side  
gate driver. Connect a 0.1F ceramic capacitor between this  
pin and the SW pin.  
1
2
3
1
2
3
Power input. The input voltage range is from 4V to 60V.  
Connect a suitable input capacitor between this pin and GND,  
usually two 2.2F or larger ceramic capacitors with one  
typical capacitance 4.7F.  
Enable control pin with internal pull-up current source. Float  
or provide a logic-high ( 1.2V) enables the converter; a  
logic-low forces the device into shutdown mode.  
EN  
Soft-start and tracking control input. Connect a capacitor from  
SS to GND to set the soft-start period. ”Do Not” leave this pin  
floating to avoid inrush current during power up. It also can  
be used to track and sequence because the SS/TR pin  
voltage can override the internal reference voltage.  
--  
4
SS/TR  
Frequency setting and external synchronous signal input.  
Connect a resistor from this pin to GND to set the switching  
frequency. Tie to a clock source for synchronization to an  
external frequency.  
4
5
5
6
RT/SYNC  
FB  
Output voltage sense. Sense the output voltage at the FB pin  
through a resistive divider. The feedback reference voltage is  
0.8V typically.  
Compensation node. Connect external compensation  
elements to this pin to stabilize the control loop.  
6
7
7
8
COMP  
GND  
Ground. Provide the ground return path for the control  
circuitry.  
Switch node. SW is the switching node that supplies power  
to the output. Connect the output LC filter from SW to the  
output load.  
8
9
SW  
Open-drain power-good indication output. Once being  
started-up, PGOOD will be pulled low to GND if any internal  
protection is triggered.  
--  
10  
PGOOD  
Exposed pad. The exposed pad is internally unconnected  
and must be soldered to a large PCB copper area for  
maximum power dissipation.  
9 (Exposed Pad)  
11 (Exposed Pad) PAD  
Copyright 2020 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
DS6363-01 March 2020  
www.richtek.com  
3

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