Datasheet > RS138T

RS138T

更新时间： 2024-04-09 19:01:37

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RS138T 数据手册

RS138T

7 SPECIFICATIONS

7.1 Absolute Maximum Ratings ⁽¹⁾

over operating free-air temperature range (unless otherwise noted) ^{(1) (2)}

MIN

MAX

UNIT

V_CC

I_IK

Supply voltage range

-0.5

Input clamp diode current

Output clamp diode current

For V_I< 0.5V or V_I> V_CC+ 0.5V

For V_O< -0.5V or V_O> V_CC+0.5V

±20

±25

±50

150

I_OK

I_O

Output source or sink current per output pin For V_O> -0.5V or V_O< V_CC+0.5V

Continuous current through V_CCor GND

SOIC-16(SOP16)

Package thermal impedance ⁽³⁾

θ_JA

°C/W

TSSOP-16

T_J

Junction temperature ⁽⁴⁾

°C

-65

150

300

Tstg

Storage temperature

Lead temperature (Soldering 10s) (SOIC - Lead Tips Only) 300 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The package thermal impedance is calculated in accordance with JESD-51.

(4) The maximum power dissipation is a function of T_J(MAX), R_θJA, and T_A. The maximum allowable power dissipation at any ambient

temperature is P_D= (T _J(MAX)- T_A) / R_θJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings

The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002⁽²⁾

Machine model (MM)

±2000

±1000

±200

V_(ESD)Electrostatic discharge

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

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