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RC1608F1502CS PDF预览

RC1608F1502CS

更新时间： 2023-06-15 00:00:00
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
12页 165K
描述
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 15000ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP

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RC1608F1502CS 数据手册

 浏览型号RC1608F1502CS的Datasheet PDF文件第6页浏览型号RC1608F1502CS的Datasheet PDF文件第7页浏览型号RC1608F1502CS的Datasheet PDF文件第8页浏览型号RC1608F1502CS的Datasheet PDF文件第10页浏览型号RC1608F1502CS的Datasheet PDF文件第11页浏览型号RC1608F1502CS的Datasheet PDF文件第12页 
THICK FILM CHIP RESISTORS  
CHARACTERISTICS PERFORMANCE  
ELECTRICAL CHARACTERISTICS  
Item  
Specification  
Test Method  
Within the regulated resistance tolerance.  
Applying time:within 5 sec  
Resistance range(Ω)  
100  
Direct Current  
Resistance  
Jumper chip ꢃ50  
㏁
Max test voltage(V)  
R
0.3  
1.0  
3
10  
25  
50  
100ꢃR 1K  
1KꢃR 10K  
10KꢃR 100K  
100KꢃR 1M  
1MꢃR  
→
→
→
→
T.C.R(Resistance  
Temperature  
Characteristic)  
1ꢃR 10:+300ppm/℃  
-200ppm/℃  
10ꢃR 1M:±100ppm/℃  
1MꢃRꢃ10M:±300ppm/℃  
Test temperature(℃) (20) (-55) (20) (125) (20)  
T.C.R(ppm/℃) = (R-Ro)/Ro×1/(T-To) ×106  
T = 20(℃)  
T = Test temperature(℃)  
Ro = Resistance at room temperature(Ω)  
R = Resistance at T(Ω)  
△
Apply 2.5 times rated voltage for 5sec.  
Wait 30 minutes at room temperature and measure the  
resistance value.  
R : ꢃ±(1%+0.1Ω) of the initial value  
Short-time Overload  
Visual : No evidence of mechanical damage  
Jumper chip : ꢃ50  
㏁
△
Perform 10,000 cycles at 2.5 times RCW or the Max.  
over load voltage  
ON(2.5 times rated volage) : 1 sec  
Intermittent  
Overload  
R : ꢃ±(3%+0.1Ω) of the initial value  
Visual : No evidence of mechanical damage  
Jumper chip : ꢃ50  
㏁
OFF  
: 25 sec  
Have stabilization time of 30 minutes without loading  
and measure resistance.  
No evidence of mechanical damage.  
Over the 1000  
Apply AC 500V for 1 minute.  
1005(1/16W), 1608(1/16W):Apply AC 100V for 1 minute  
Dielectric withstand-  
ing Voltage  
Insulation Resistance  
Apply DC 500V for 1 minute.  
1005(1/16W), 1608(1/16W):Apply DC 100V for 1 minute  
㏁
MECHANICAL CHARACTERISTICS  
Item  
Specification  
Test Method  
Solderability  
Coverage : ꢂ95% each termination.  
Visual : No crack of termination parts and  
ceramic exposure of surface by melting  
After immersing in flux. dip into the 235±5℃ molten  
solder for 2±0.5 sec  
Solder : S63A(KSD 6704)  
Flux : ROSIN(KSM 2951)  
Flux is the composition of ROSIN and the methanol Weight  
rate of ROSIN is about 25%  
△
After soldering resistor on the  
PCB, 3mm of bending shall  
be applied for 10 sec.  
Bending Test  
R : ꢃ±(0.5%+0.05Ω) of the initial value  
Visual : No evidence of mechanical damage.  
Material of PCB : Glass Epoxy  
Thickness : 1.6mm  
Measure resistance during load application  
pull Direction fixed 0.4 lead  
Terminal Strenght  
Terminal Strenght  
Load pull : ꢂ0.5kg  
1005(1/16W), 1608(1/16W)ꢂ0.3kg  
△
R : ꢃ±(1%+0.05Ω) of the initial value  
Immerse in molten solder at 260±5℃for 10±1 sec.  
Preheat and soldering Procedure  
Visual : No evidence of mechanical damage.  
Time(sec)  
Temperature(℃)  
Solder : S63A(SSD 6704)  
Flux : The composition of ROSIN  
(KSM295)25% and methanol  
(KSM 1658)75%  
80 - 100  
150 - 180  
260 + 5  
150 - 180  
80 - 100  
120  
120  
10  
60  
60  
△
2 hours each in X, Y, and Z axis(toyal 6 hours) 10 to  
55 Hz sweep in 1 minute ampiltude.  
Anti-Vibration Test  
R : ꢃ±(1%+0.05Ω) of the initial value  
Visual : No evidence of mechanical damage.  
12  
1...6789101112

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