Datasheet > QTE-028-01-L-D-DP-A-L-K-TR

QTE-028-01-L-D-DP-A-L-K-TR

更新时间： 2024-02-25 19:12:31

品牌	Logo	应用领域
申泰 - SAMTEC		连接器
页数	文件大小	规格书
1页	320K
描述
Board Stacking Connector

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技术参数
数据手册

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QTE-028-01-L-D-DP-A-L-K-TR 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8536.69.40.40	Factory Lead Time：	2 weeks
风险等级：	5.77	Is Samacsys：	N
连接器类型：	BOARD STACKING CONNECTOR	Base Number Matches：	1

QTE-028-01-L-D-DP-A-L-K-TR 数据手册

F-217

QTE–014–01–F–D–DP–A

QTE–040–01–L–D–A

QTE–060–01–L–D–A

(0.80 mm) .0315"

QTE SERIES

HIGH-SPEED GROUND PLANE HEADER

Integral metal plane

for power or ground

Board Mates:

QSE

SPECIFICATIONS

Standard stack heights

from 5 mm to 25 mm

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?QTE

Cable Mates:

EQCD, EQDP

(See Also Available Note)

Insulator Material:

Liquid Crystal Polymer

Terminal Material:

Phosphor Bronze

Standoffs:

Plating: Au or Sn over

50 µ" (1.27 µm) Ni

Current Rating:

Contact:

2 A per pin

(1 pin powered per row)

Ground Plane:

23 A per ground plane

(1 ground plane powered)

Operating Temp Range:

-55 °C to +125 °C

Voltage Rating:

HIGH-SPEED CHANNEL PERFORMANCE

10 YEAR MFG

WITH 50 µ" GOLD

QTE-DP/QSE-DP @ 5 mm Mated Stack Height

EXTENDED LIFE

Rating based on Samtec reference channel.

For full SI performance data visit Samtec.com

PRODUCT

225 VAC mated with QSE

& 5 mm Stack Height

Max Cycles: 100

HIGH MATING

CYCLES

or contact SIG@samtec.com

RoHS Compliant: Yes

PROCESSING

Lead–Free Solderable: Yes

SMT Lead Coplanarity:

(0.10 mm) .004" max (020-060)

Board Stacking:

For applications requiring

more than two connectors per

board contact ipg@samtec.com

LEAD

STYLE

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

OTHER

OPTION

TYPE

QTE

Specify

LEAD

STYLE

from

–K

RECOGNITIONS

= (7.00 mm)

.275" DIA

Polyimide

Film Pick &

Place Pad

–020, –040, –060

–F

–D

(40 total pins per bank = –D)

For complete scope of

recognitions see

www.samtec.com/quality

= Gold Flash

= Single-Ended

on Signal Pins and

Ground Plane,

Matte Tin on tails

chart

–014, –028, –042

–D–DP

= Differential Pair

(–01 only)

(14 pairs per bank = –D–DP)

–TR

= Tape & Reel

Packaging

(N/A –05 & –07

lead style)

FILE NO. E111594

FILE NO: 090871_0_000

–L

= 10 µ" (0.25 µm)

Gold on Signal Pins

and Ground Plane,

Matte Tin on tails

–D–DP = (No. of Positions per Row/14)

x (20.00) .7875

PROTOCOLS

• 100 GbE

–D = (No. of Positions per Row/20)

x (20.00) .7875

• XAUI

• PCI Express^®

–L

(20.00) .7875

–C*

= Latching

Option

= Electro-Polished

Selective

• SATA

(5.97)

.235

(7.11)

.280

• MGT (Rocket I/O)

• InﬁniBand^™

(N/A on –042 &

–060 positions)

50 µ" (1.27 µm) min

Au over 150µ"

(3.81 µm) Ni on Signal

Pins in contact area,

10 µ" (0.25 µm) min

Au over 50 µ" (1.27 µm)

Ni on Ground Plane

in contact area,

MatteTin over 50µ"

(1.27 µm) min Ni on

all solder tails

(0.80)

.0315

(0.20)

.008

ALSO AVAILABLE

(MOQ Required)

QTE

LEAD

STYLE

HEIGHT

WITH QSE*

• 15 mm, 22 mm and

30 mm stack height

(4.27) .168 (5.00) .197

(7.26) .286 (8.00) .315

(10.27) .404 (11.00) .433

(15.25) .600 (16.00) .630

(18.26) .718 (19.00) .748

(24.24) .954 (25.00) .984

(13.26) .522 (14.00) .551

–01

–02

–03

–04

–05

–07

–09

• 30 µ" (0.76 µm) Gold

(Specify -H plating for

Data Rate cable mating

applications.)

(0.76)

.030

• Edge Mount, Guide Posts,

Screw Down & Friction Lock

*Note: –C Plating passes

10 year MFG testing

• 56 (-DP), 80, 100

positions per row

Note: Some lengths, styles

and options are non-standard,

non-returnable.

(0.64)

.025

(0.89)

.035 DIA

*Processing conditions will affect

mated height. See SO Series for

board space tolerances

• Retention Option

Contact Samtec.

–L

WWW.SAMTEC.COM

Due to technical progress, all designs, speciﬁcations and components are subject to change without notice.

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