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QSH-040-01-L-D-DP-A-K PDF预览

QSH-040-01-L-D-DP-A-K

更新时间: 2024-01-06 19:50:12
品牌 Logo 应用领域
申泰 - SAMTEC 连接器集管和边缘连接器PC局域网
页数 文件大小 规格书
1页 1059K
描述
Board Stacking Connector, 80 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

QSH-040-01-L-D-DP-A-K 技术参数

生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.78板上安装选件:SPLIT BOARD LOCK
主体宽度:0.285 inch主体深度:0.128 inch
主体长度:1.625 inch连接器类型:BOARD STACKING CONNECTOR
联系完成配合:AU触点性别:FEMALE
触点材料:PHOSPHOR BRONZE触点模式:RECTANGULAR
触点样式:BELLOWED TYPE耐用性:100 Cycles
绝缘体颜色:BLACK绝缘体材料:LIQUID CRYSTAL POLYMER (LCP)
插接触点节距:0.02 inch安装选项1:LOCKING
安装方式:STRAIGHT安装类型:BOARD
连接器数:ONEPCB行数:2
装载的行数:2最高工作温度:125 °C
最低工作温度:-55 °CPCB接触模式:RECTANGULAR
PCB触点行间距:5.7404 mm极化密钥:POLARIZED HOUSING
额定电流(信号):2 A参考标准:UL, CSA
可靠性:COMMERCIAL子类别:Headers and Edge Type Connectors
端子节距:0.508 mm端接类型:SURFACE MOUNT
触点总数:80Base Number Matches:1

QSH-040-01-L-D-DP-A-K 数据手册

  
F-213  
QSH–060–01–L–D–DP–A  
®
QSH–060–01–L–D–A–K  
(0,50 mm) .0197"  
QSH SERIES  
QSH–030–01–F–D–A  
HIGH SPEED GROUND PLANE SOCKET  
Blade &  
Beam Design  
Integral metal plane  
for power or ground  
Board Mates:  
QTH  
SPECIFICATIONS  
®
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?QSH  
Cable Mates:  
HQCD, HQDP  
(See Application Specific note)  
Insulator Material:  
Liquid Crystal  
Polymer  
TM  
Contact Material:  
Phosphor Bronze  
Plating:  
EXTENDED LIFE PRODUCT  
Au or Sn over  
10 year Mixed Flowing Gas with 50µ" Gold  
Call Samtec for maximum cycles mated with QTH  
50µ" (1,27 µm) Ni  
Current Rating:  
Contact:  
1.0A per contact @ 30°C  
Temperature Rise  
Ground Plane:  
Rated @ 3dB Insertion Loss  
with PCB effects* w/o PCB effects**  
9 GHz / 18 Gbps 9.5 GHz / 19 Gbps  
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps  
QTH/QSH  
Type  
5 mm Stack Height  
7.8A per ground plane @ 30°C  
Temperature Rise  
Operating Temp Range:  
-55°C to +125°C  
Voltage Rating:  
125 VAC (5 mm Stack Height)  
Max Cycles:  
Single-Ended Signaling  
Differential Pair Signaling  
Differential Pair Signaling  
–D  
–D  
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps  
*Performance data includes effects of a non-optimized PCB.  
**Test board losses de-embedded from performance data.  
100  
Performance data for other stack heights and complete test data  
available at www.samtec.com?QSH or contact sig@samtec.com  
RoHS Compliant:  
Yes  
Processing:  
PINS PER ROW  
PLATING  
OTHER  
Lead-Free Solderable:  
Yes  
TYPE  
QSH  
A
01  
NO. OF PAIRS  
OPTION  
OPTION  
SMT Lead Coplanarity:  
(0,10 mm) .004" max (030-060)  
(0,15 mm) .006" max (090)  
Board Stacking:  
For applications requiring  
more than two connectors per  
board contact ipg@samtec.com  
–F  
= Gold Flash  
–D  
= Single-  
Ended  
–K  
–030, –060, –090  
on Signal Pins  
and Ground Plane,  
MatteTin on tails  
= (8,25 mm)  
.325" DIA  
(60 total pins per bank = –D)  
APPLICATION  
SPECIFIC OPTION  
• 14 mm, 15 mm, 22 mm  
and 30 mm stack height  
(Caution: Some automatic  
placement/inspection  
Polyimide Film  
Pick & Place Pad  
–020, –040, –060  
–D–DP  
= Differential  
Pair  
(20 pairs per bank = –D–DP)  
–L  
= 10µ" (0,25 µm)  
Gold on Signal Pins  
and Ground Plane,  
MatteTin on tails  
–TR  
–D = (No. of Pins per Row/30) x  
(20,00) .7875 + (1,27) .050  
(–01 only)  
= Tape & Reel  
(–090 positions  
maximum)  
–DP = (No. of Pairs per Row/20) x  
(20,00) .7875 + (1,27) .050  
machines may have  
component height  
restrictions. Please consult  
machinery specifications.)  
• 30µ" (0,76 µm) Gold  
(Specify -H plating for Data  
Rate cable mating  
applications.)  
• Edge Mount & Guide Posts  
• 80(-DP), 120, 150  
positions per row  
• Retention Option  
Call Samtec.  
–C*  
(20,00) .7875  
–L  
02  
= Electro-Polished  
Selective  
= Latching  
Option  
QTH  
LEAD  
MATED  
HEIGHT  
(7,49)  
.295  
50µ" (1,27 µm) min Au  
over 150µ" (3,81 µm)  
Ni on Signal Pins  
in contact area,  
10µ" (0,25 µm) min Au  
over 50µ" (1,27 µm)  
Ni on Ground Plane  
in contact area,  
STYLE WITH QSH*  
(N/A on  
–060 (–D–DP),  
–080, –090 &  
–120 positions)  
(5,00) .197  
–01  
–02  
–03  
–04  
–05  
–07  
01  
(0,50)  
.0197  
(0,15)  
.006  
(8,00) .315  
(11,00) .433  
(16,00) .630  
(19,00) .748  
MatteTin over 50µ"  
(1,27 µm) min Ni  
on all solder tails  
(25,00) .984  
(3,25)  
.128  
(3,05)  
.120  
*Processing  
conditions will  
affect mated height.  
(7,24)  
.285  
(0,76)  
.030  
ALSO  
AVAILABLE  
*Note: –C Plating passes  
10 year MFG testing  
(0,89)  
.035  
DIA  
Board Spacing Standoffs.  
See SO Series.  
(0,64)  
.025  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
–L  
WWW.SAMTEC.COM  

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