REVISION X
((No OF POSITIONS / 20) x .7875[20.003]) + .440[11.18] REF
QSE-XXX-01-X-D-EMX-XX
No OF POSITIONS
C1
OPTION
-020, -040, -060
**-080, **-100
(PER ROW)
-GP: GUIDE POST (60 POS MAX)
*
((No OF POSITIONS / 20) x .7875[20.003]) + .0100[.254] REF
(SEE FIG. 2, SEE SHEET 2)
-TY: TRAY PACKAGING
* EM3-GP = NOT TOOLED
EDGE MOUNT THICKNESS
.793 20.14 REF
19 EQ SPACES
LEAD STYLE
-01: .1380 [3.505]
@ .0315[.800]
02
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
-EM3:
DO NOT
SCALE FROM
THIS PRINT
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD
WITH MATTE TIN TAILS
(USE C-162-XX-F & T-1G13-01-F)
(SEE NOTE 6)
.2850 7.239
REF
(USE QSE-20-01-D-EM3-XX & C-162-02-X)
SEE NOTE 10
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
-L: LIGHT SELECTIVE GOLD
WITH MATTE TIN TAILS
(USE C-162-XX-L & T-1G13-01-L)
-H: HEAVY GOLD
01
'A'
.625 15.88
REF
No OF BANKS
.022 0.57
REF
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD
C2
X
X
QSE-20-01-D-EM3-XX
.118 3.00
QSE-20-01-D-EM2-XX
.1380±.0030 3.505±0.08
(SEE NOTE 5)
T-1G13-01-X
C-162-02-X
C-162-01-X
.1750 4.445
REF
"A"
"A"
.238 6.05
REF
SEE TABLE 1
X
.120 3.05 REF
.0660±.0030 1.676±0.08
.155 3.92
REF
.0920±.0030 2.338±0.08
.006 0.15
REF
C4
.1200 3.048
REF
X
SECTION "A"-"A"
-EM2: .064[1.63] +/-.004 PCB
.7250 18.415
REF
SECTION "A"-"A"
2
MAX SWAY
(TYP)
-EM3:
SEE NOTE 10
.0315 0.800
REF
[DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS]
NOTES:
* = SEE NOTE 10
** = SEE NOTE 11
C
FIG. 1
1.
REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE MOLD TO POSITION.
5. MAX VARIANCE OF .002[.05].
.0400 1.016 REF
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER
PAD TO SOLDER PAD.
9. SEE WWW.SAMTEC. COM/PROCESSING/
EDGEMOUNT_TECTALK/INDEX.HTM FOR INFORMATION ON
PROCESSING EDGEMOUNT PARTS TO BOARDS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH
ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT
SAMTEC INTERCONNECT PROCESSING GROUP.
.100 2.54 REF
.1400 3.556 REF
PROPRIETARY NOTE
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
.XX: .01[.3]
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
.XXX: .005[.13]
PHONE: 812-944-6733
FAX: 812-948-5047
code: 55322
.XXXX: .0020[.051]
e-Mail: info@SAMTEC.com
SHEET SCALE: 1.375:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
.8mm EDGE MOUNT HS SOCKET ASSEMBLY
INSULATOR: LCP, -EM2 COLOR: BLACK
-EM3 COLOR: NATURAL
CONTACT & GROUND PLANE: PHOS BRONZE
NO.
DWGQ. SE-XXX-01-X-D-EMX-XX
SHEET 1 OF 2
BY:
DEAN P
5/24/2000
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-EMX-XX-MKT.SLDDRW