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Datasheet > QRF8-052-07.0-L-D-A
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QRF8-052-07.0-L-D-A

更新时间： 2024-10-02 15:48:55
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
1页 1286K
描述
Board Stacking Connector, 104 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT

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QRF8-052-07.0-L-D-A 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliantFactory Lead Time：2 weeks
风险等级：5.75其他特性：EDGE RATE, E.L.P.
主体/外壳类型：SOCKET连接器类型：BOARD STACKING CONNECTOR
联系完成配合：GOLD (10) OVER NICKEL (50)联系完成终止：Matte Tin (Sn) - with Nickel (Ni) barrier
触点性别：FEMALE触点材料：PHOSPHOR BRONZE
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOJESD-609代码：e3
MIL 符合性：NO插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：2
选件：GENERAL PURPOSE端子节距：0.8 mm
端接类型：SURFACE MOUNT触点总数：104
UL 易燃性代码：94V-0Base Number Matches：1

QRF8-052-07.0-L-D-A 数据手册

  
F-213 (Rev 13AUG13)  
QRF8–078–05.0–L–D–A  
QRF8–036–05.0–L–D–DP–A  
®
(0,80 mm) .0315"  
QRF8 SERIES  
QRF8–026–05.0–L–D–A  
SLIM BODY GROUND PLANE SOCKET  
®
Increased wipe  
for rugged applications  
Integral  
ground/power  
plane  
™
Board Mates:  
SPECIFICATIONS  
QRM8, EQRD  
Edge Rate™  
contacts  
For complete specifications and  
recommended PCB layouts see  
www.samtec.com?QRF8  
(1,20 mm)  
.047"  
NOMINAL  
WIPE  
Insulator Material:  
Black LCP  
Contact Material:  
BeCu  
TM  
Ground Plane Material:  
Phosphor Bronze  
Plating:  
EXTENDED LIFE PRODUCT  
Au or Sn over  
10 Year Mixed Flowing Gas (MFG)  
50µ" (1,27 µm) Ni  
Current Rating:  
2.0A per contect @ 80°C  
ambient  
(6 contacts powered)  
Operating Temp Range:  
-55°C to +125°C  
Voltage Rating:  
215 VAC  
RoHS Compliant:  
Yes  
Call Samtec for maximum cycles mated with QRM8  
Rated @ 3dB Insertion Loss  
with PCB effects* w/o PCB effects**  
–D 9.5 GHz / 19 Gbps 15 GHz / 30 Gbps  
QRM8/QRF8  
Type  
7 mm Stack Height  
Single-Ended Signaling  
Differential Pair Signaling –D 8.5 GHz / 17 Gbps 12.5 GHz / 25 Gbps  
Differential Pair Signaling –DP 9 GHz / 18 Gbps ––––  
*Performance data includes effects of a non-optimized PCB.  
**Test board losses de-embedded from performance data.  
Processing:  
Performance data for other stack heights and complete test data  
available at www.samtec.com?QRF8 or contact sig@samtec.com  
Lead–Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0,10 mm) .004" max (018-026)  
(0,15 mm) .006" max (036-078)  
LEAD  
STYLE  
PINS PER ROW  
NO. OF PAIRS  
PLATING  
OPTION  
OTHER  
OPTION  
TYPE  
QRF8  
A
RECOGNITIONS  
For complete scope of  
recognitions see  
–L  
–05.0  
= 5 mm  
Body  
www.samtec.com/quality  
= 10 µ"  
–D  
–GP  
–026, –052, –078  
(0,25 µm)  
Gold on  
contact,  
Matte Tin  
on tail  
= Single-Ended  
= Guide Post  
(52 total pins per bank = –D)  
Height  
(Requires –GP on  
mating connector)  
–D–DP  
= Differential  
Pair  
–018, –036, –054  
–07.0  
= 7 mm  
Body  
MATED HEIGHT*  
(18 pairs per bank = –D–DP)  
QRF8  
–K  
QRM8 LEAD STYLE  
LEAD  
= (5,00 mm) .197" DIA  
Polyimide Film  
STYLE –02.0  
–05.0 –07.0  
Height  
(7,00) (10,00) (12,00)  
Pick & Place Pad  
–05.0  
.276  
(9,00) (12,00) (14,00)  
.354 .472 .551  
.394  
.472  
No. of Banks x (24,80) .976 + (3,57) .140  
–07.0  
01  
02  
–TR  
= Tape & Reel  
(–018, –026,  
(4,60)  
.181  
*Processing conditions will  
affect mated height.  
–036, –052 only)  
(0,80)  
.0315  
(4,60)  
.181  
ALSO AVAILABLE  
(MOQ Required)  
(1,04)  
.041  
A
(1,25)  
• Other Platings  
Contact Samtec.  
.049  
(0,20)  
.008  
(0,23) .009  
(1,00) .039 DIA  
LEAD  
No. of Banks x (24,80) .976 - (2,00) .078  
A
STYLE  
(5,01)  
.197  
(7,01)  
.276  
–05.0  
–07.0  
• Edge Rate™  
contacts  
No. of Banks x (24,80) .976 + (5,25) .206  
• Increased contact  
wipe  
• 10 year MFG  
–GP OPTION  
• Guide post option  
Note: Some lengths, styles  
and options are non-standard,  
non-returnable.  
WWW.SAMTEC.COM  
1

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