Datasheet > QMS-016-06.75-L-D-DP-A

QMS-016-06.75-L-D-DP-A

更新时间： 2024-01-22 16:31:35

品牌	Logo	应用领域
申泰 - SAMTEC		连接器
页数	文件大小	规格书
1页	980K
描述
Board Connector, 32 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

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技术参数
数据手册

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QMS-016-06.75-L-D-DP-A 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	ROHS COMPLIANT
Reach Compliance Code：	compliant	Factory Lead Time：	2 weeks
风险等级：	5.78	其他特性：	Q2
连接器类型：	BOARD CONNECTOR	联系完成配合：	GOLD (10) OVER NICKEL (50)
联系完成终止：	Tin (Sn) - with Nickel (Ni) barrier	触点性别：	MALE
触点材料：	PHOSPHOR BRONZE	DIN 符合性：	NO
滤波功能：	NO	IEC 符合性：	NO
JESD-609代码：	e3	MIL 符合性：	NO
插接信息：	MULTIPLE MATING PARTS AVAILABLE	混合触点：	NO
安装方式：	STRAIGHT	安装类型：	BOARD
装载的行数：	2	选件：	GENERAL PURPOSE
端子节距：	0.635 mm	端接类型：	SURFACE MOUNT
触点总数：	32	Base Number Matches：	1

QMS-016-06.75-L-D-DP-A 数据手册

F-213

QMS–032–06.75–L–D–DP–A

QMS–026–06.75–L–D–A

(0,635 mm) .025"

QMS SERIES

RUGGED GROUND PLANE HEADER

Integral metal plane

for power or ground

Increased

insertion depth for

rugged applications

Board Mates:

QFS

SPECIFICATIONS

For complete speciﬁcations and

recommended PCB layouts see

www.samtec.com?QMS

Insulator Material:

Liquid Crystal

Polymer

Terminal & Ground

Plane Material:

Phosphor Bronze

Plating:

Au over 50µ" (1,27 µm) Ni

(Tin on Ground Plane Tail)

Current Rating:

Contact:

1.6A per contact @ 95°C

Ground Plane:

9.2A per ground plane @ 95°C

Voltage Rating:

300 VAC mated with QFS

Operating Temp:

-55°C to +125°C

RoHS Compliant:

Yes

APPLICATION

SPECIFIC

•

Power & RF options

Edge Mount

•

• Guide Posts

• Without PCB

Alignment Pins

(05.75 and 06.75 only)

• Hot Pluggable

• 64 (-DP) and 104

positions per row

Rated @ 3dB Insertion Loss

QMS/QFS

Type

10 mm Stack Height

with PCB effects* w/o PCB effects**

(1,60 mm)

.063"

NOMINAL

WIPE

Single-Ended Signaling

–D

9 GHz / 18 Gbps

8 GHz / 16 Gbps

8.5 GHz / 17 Gbps

9 GHz / 18 Gbps

Differential Pair Signaling –D

Differential Pair Signaling –DP 7.5 GHz / 15 Gbps

*Performance data includes effects of a non-optimized PCB.

**Test board losses de-embedded from performance data.

Performance data for other stack heights and complete test data

available at www.samtec.com?QMS or contact sig@samtec.com

Processing:

Call Samtec.

Lead–Free Solderable: Yes

SMT Lead Coplanarity:

(0,10 mm) .004" max (026-052)

(0,15 mm) .006" max (078)

Board Stacking:

LEAD

STYLE

PINS PER ROW

NO. OF PAIRS

PLATING

OPTION

OTHER

OPTION

TYPE

QMS

For applications requiring more

than two connectors per board,

contact ipg@samtec.com

Specify

LEAD

STYLE

from

–K

.217" DIA

Polyimide

ﬁlm

Pick &

Place Pad

= (5,50 mm)

–L

–D

–026, –052, –078

(–05.75 and –06.75 lead style only)

= 10µ" (0,25 µm) Gold on Signal

Pins and Ground Plane

= Single-Ended

(52 total pins per bank = –D)

chart

–D–DP

–016, –032, –048

(Tin on Signal Pin tails, and

Ground Plane tails)

= Differential Pair

(16 pairs per bank = –D–DP)

–SL

MATED HEIGHT*

APPLICATION

(–09.75 lead style only)

= 10µ" (0,25 µm) Gold on Signal

Pins and Ground Plane

(Tin on Signal Pin tails, and

Ground Plane tails)

QFS LEAD STYLE

–04.25 –06.25

LEAD

STYLE

(5,38) .212 10 mm

(6,35) .250 11 mm

(9,35) .368 14 mm

12 mm

13 mm

16 mm

–05.75

–06.75

–09.75

STACK

HEIGHT

(0,44)

.017

(0,25)

.010

*Processing conditions will affect mated height.

(6,35)

.250

Requires Standoff

(No. of Banks) x (21,34) .840 - (0,51) .020

(21,34) .840

SO-1524-03-01-01-L for 15,24 mm

or SO-2215-02-01-01-L for 22 mm

board spacing. Connectors designed

to not fully seat when mated.

(7,52)

.296

(7,26)

.286

INTERCONNECTS

STACK

INDUSTRY

STANDARD

(2,29)

.090

(0,635)

.025

(0,23)

.009

TERMINAL SOCKET BANKS

HEIGHT

15,24 mm

22 mm

SUMIT^™

ASP-129637-01 ASP-129646-01

PCI/104-Express^™ASP-129637-03 ASP-129646-03

PCI/104-Express^™ASP-142781-02 ASP-129646-02

PCI/104-Express^™ASP-142781-03 ASP-129646-03

22 mm

Note: Some lengths,

–D

–D–DP

styles and options are

non-standard, non-returnable.

WWW.SAMTEC.COM

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