PS35 thru PS36
Surface Mount Schottky Rectifier
Reverse Voltage 50~60V Forward Current 3.0A
Features
• Heatsink structure
• Low profile, typical thickness 0.8mm
• Super Low VF Schottky barrier diodes
• Moisture sensitivity: level 1, per J-STD-020
iSGA
(SOD-123HS)
• High temperature soldering guaranteed: 260℃/10 seconds
Typical Applications
For use of fast swiching in RF module, lighting, cellular phone, portable device, power supplies
and other consumer applications.
Maximum Ratings (TA = 25 °C unless otherwise noted)
PS35
PS36
Unit
Parameter
Symbol
50
35
50
60
42
60
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
V
V
V
A
VRRM
VRMS
VDC
3.0
IF(AV)
100
A
IFSM
A2sec
°C
I2t
TJ
41.70
Rating for fusing(t<8.3ms)
- 55 to + 150
- 55 to + 150
Operating junction temperature range
Storage temperature range
TSTG
°C
Electrical Characteristics (TA = 25 °C unless otherwise noted)
Typ.
Max.
Unit
Parameter
Test Conditions Symbol
60
VBR
VF
Ta=25℃,IR=1mA
IF=3A,Ta=25℃
IF=3A,Ta=125℃
Ta=25℃
Minimum Breakdown voltage
Instantaneous forward voltage
Volts
0.61
0.52
4.1
0.65
0.60
50
uA
mA
pF
Instantaneous reverse current
at rated DC blocking voltage
IR
3.8
10
Ta=125℃
160
60
6
CJ
Typical junction capacitance
Typical thermal resistance
4.0 V, 1 MHz
1)
juntion to ambient
juntion to lead
RθJA
RθJL
1)
2)
℃/W
28
juntion to case
RθJC
Note:1),The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB
2),The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads,2 OZ,FR4 PCB
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2016.05-Rev.A