Product specification
9
12
0204/0306/0612
SERIES
PS
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 8 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
MIL-STD-202-method 108
IEC 60115-1 4.25.1
1,000 hours at 70±2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(1%+0.0005 Ω)
Life/
Operational Life/
Endurance
1,000 hours at 125 °C &155 °C ,unpowered
IEC 60068-2-2
±(1%+0.0005 Ω)
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202-method 106
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
±(0.5%+0.0005 Ω)
Moisture
Resistance
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
MIL-STD-202-method 107
-55/+125 °C
±(1%+0.0005 Ω)
Thermal Shock
Note: Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air – Air
IEC60115-1 4.13
IEC 60068-2-21
5 times of rated power for 5 seconds at room
temperature
±(1%+0.0005 Ω)
Short Time
Overload
No visible damage
Chips mounted on a 90mm glass epoxy resin
PCB(FR4)
2 mm bending
±(1%+0.0005 Ω)
Board Flex/
Bending
No visible damage
Bending time: 60±5 seconds
www.yageo.com
Oct 25, 2023 V.3