Datasheet > PGB101ST23MR

PGB101ST23MR

更新时间： 2024-02-20 18:19:33

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力特 - LITTELFUSE		/
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4页	239K
描述
PGB1 Series Halogen-Free / Lead-Free

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PGB101ST23MR 数据手册

PulseGuard^®Suppressors

Surface Mount Polymeric ESD Suppressors

Physical Speciﬁcations

Environmental Speciﬁcations

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OperatingTemperature

Moisture Resistance

-65°C to +125°C

Materials

0402 series:

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Solderability

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0603, ST23:

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Soldering

Parameters

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-65°C to 125°C, 30 min. cycle,

10 cycles

Thermal Shock

Design Consideration

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to 55 to 10 Hz, 1 min. cycle, 2

hrs each in X-Y-Z)

Because of the fast rise-time of the ESD transient, proper

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consideration to achieving optimal ESD suppression. The

devices should be placed on the circuit board as close to the

source of the ESD transient as possible. Install PulseGuard

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directly behind the connector so that they are the ﬁrst board-

level circuit component encountered by the ESD transient.

Vibration

Chemical Resistance

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Solder Leach Resistance and

Terminal Adhesion

Soldering Parameters

Reﬂow Condition

-Temperature Min (T_s(min)

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)

150°C

Pre Heat -Temperature Max (T_s(max)

-Time (min to max) (t_s)

)

200°C

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Average ramp up rate (LiquidusTemp

(T_L) to peak

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T_S(max)toT_L- Ramp-up Rate

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-Temperature (T_L) (Liquidus)

Reﬂow

-Temperature (t_L)

60 – 150 seconds

260°C

PeakTemperature (T_P)

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Time within 5°C of actual peak

Temperature (t_p)

10 – 30 seconds

Ramp-down Rate

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Time 25°C to peakTemperature (T_P)

PGB1 Series

www.littelfuse.com

Speciﬁcations are subject to change without notice.

Revised: January 11, 2012

1 234

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