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PCA9535BS,118 PDF预览

PCA9535BS,118

更新时间: 2024-02-21 00:49:51
品牌 Logo 应用领域
恩智浦 - NXP PC外围集成电路
页数 文件大小 规格书
31页 170K
描述
PCA9535; PCA9535C - 16-bit I2C-bus and SMBus, low power I/O port with interrupt QFN 24-Pin

PCA9535BS,118 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFN包装说明:HVQCCN, LCC24,.16SQ,20
针数:24Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:1.05
JESD-30 代码:S-PQCC-N24JESD-609代码:e4
长度:4 mm湿度敏感等级:1
位数:16I/O 线路数量:16
端口数量:2端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC24,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:2.5/5 V认证状态:Not Qualified
座面最大高度:1 mm子类别:Parallel IO Port
最大供电电压:5.5 V最小供电电压:2.3 V
标称供电电压:3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:NICKEL PALLADIUM GOLD端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:4 mm
uPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSEBase Number Matches:1

PCA9535BS,118 数据手册

 浏览型号PCA9535BS,118的Datasheet PDF文件第2页浏览型号PCA9535BS,118的Datasheet PDF文件第3页浏览型号PCA9535BS,118的Datasheet PDF文件第4页浏览型号PCA9535BS,118的Datasheet PDF文件第6页浏览型号PCA9535BS,118的Datasheet PDF文件第7页浏览型号PCA9535BS,118的Datasheet PDF文件第8页 
PCA9535; PCA9535C  
NXP Semiconductors  
16-bit I2C-bus and SMBus, low power I/O port with interrupt  
5.2 Pin description  
Table 3.  
Symbol  
Pin description  
Pin  
Description  
SO24, TSSOP24  
HVQFN24,  
HWQFN24  
INT  
1
22  
23  
24  
1
interrupt output (open-drain)  
address input 1  
A1  
2
A2  
3
address input 2  
port 0 input/output[2]  
IO0_0  
IO0_1  
IO0_2  
IO0_3  
IO0_4  
IO0_5  
IO0_6  
IO0_7  
VSS  
4
5
2
6
3
7
4
8
5
9
6
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
7
8
9[1]  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
supply ground  
port 1 input/output[2]  
IO1_0  
IO1_1  
IO1_2  
IO1_3  
IO1_4  
IO1_5  
IO1_6  
IO1_7  
A0  
address input 0  
serial clock line  
serial data line  
supply voltage  
SCL  
SDA  
VDD  
[1] HVQFN24 and HWQFN24 package die supply ground is connected to both the VSS pin and the exposed  
center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced  
thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using  
a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias  
need to be incorporated in the PCB in the thermal pad region.  
[2] PCA9535 I/Os are totem pole, whereas the I/Os on PCA9535C are open-drain.  
PCA9535_PCA9535C_5  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 05 — 15 September 2008  
5 of 31  
 
 
 
 

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