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PCA9535AHF PDF预览

PCA9535AHF

更新时间: 2024-02-02 13:40:38
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
38页 2397K
描述
Low-voltage 16-bit I2C-bus I/O port with interrupt

PCA9535AHF 技术参数

生命周期:Obsolete零件包装代码:QFN
包装说明:HVQCCN, LCC24/28,.14X.2,20针数:24
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.68
JESD-30 代码:R-PQCC-N24长度:5.5 mm
位数:16I/O 线路数量:16
端口数量:2端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC24/28,.14X.2,20封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE电源:2.5/5 V
认证状态:Not Qualified座面最大高度:1 mm
子类别:Parallel IO Port最大供电电压:5.5 V
最小供电电压:2.3 V标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
宽度:3.5 mmuPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches:1

PCA9535AHF 数据手册

 浏览型号PCA9535AHF的Datasheet PDF文件第32页浏览型号PCA9535AHF的Datasheet PDF文件第33页浏览型号PCA9535AHF的Datasheet PDF文件第34页浏览型号PCA9535AHF的Datasheet PDF文件第35页浏览型号PCA9535AHF的Datasheet PDF文件第36页浏览型号PCA9535AHF的Datasheet PDF文件第37页 
PCA9535A  
NXP Semiconductors  
Low-voltage 16-bit I2C-bus I/O port with interrupt  
23. Contents  
1
General description. . . . . . . . . . . . . . . . . . . . . . 1  
21.1  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 36  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 36  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
21.2  
21.3  
21.4  
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
3
3.1  
4
22  
23  
Contact information . . . . . . . . . . . . . . . . . . . . 37  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
6.1  
6.2  
6.2.1  
6.2.2  
6.2.3  
6.2.4  
6.2.5  
6.3  
Functional description . . . . . . . . . . . . . . . . . . . 5  
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 5  
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pointer register and command byte . . . . . . . . . 5  
Input port register pair (00h, 01h) . . . . . . . . . . . 6  
Output port register pair (02h, 03h) . . . . . . . . . 6  
Polarity inversion register pair (04h, 05h). . . . . 7  
Configuration register pair (06h, 07h). . . . . . . . 7  
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . . 9  
6.4  
6.5  
7
7.1  
7.2  
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9  
Writing to the port registers. . . . . . . . . . . . . . . . 9  
Reading the port registers . . . . . . . . . . . . . . . 11  
8
8.1  
Application design-in information . . . . . . . . . 14  
Minimizing IDD when the I/Os are used to  
control LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Power-on reset requirements . . . . . . . . . . . . . 15  
8.2  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17  
Recommended operating conditions. . . . . . . 17  
Thermal characteristics . . . . . . . . . . . . . . . . . 17  
Static characteristics. . . . . . . . . . . . . . . . . . . . 18  
Typical characteristics . . . . . . . . . . . . . . . . . . 20  
Dynamic characteristics . . . . . . . . . . . . . . . . . 24  
Parameter measurement information . . . . . . 25  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 28  
Handling information. . . . . . . . . . . . . . . . . . . . 30  
10  
11  
12  
12.1  
13  
14  
15  
16  
17  
Soldering of SMD packages . . . . . . . . . . . . . . 30  
Introduction to soldering . . . . . . . . . . . . . . . . . 30  
Wave and reflow soldering . . . . . . . . . . . . . . . 30  
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 30  
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 31  
17.1  
17.2  
17.3  
17.4  
18  
19  
20  
21  
Soldering: PCB footprints. . . . . . . . . . . . . . . . 33  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 35  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 35  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 36  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 11 September 2012  
Document identifier: PCA9535A  

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