Datasheet > P0404FC15C

P0404FC15C

更新时间： 2024-02-09 03:42:53

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	76K
描述
PFLIP CHIP ARRAY

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P0404FC15C 数据手册

P0404FC3.3C*

thru

P0404FC36C*

0404 PACKAGE OUTLINE & DIMENSIONS

PACKAGE DIMENSIONS

MOUNTING PAD LAYOUT - Option 2

MILLIMETERS

DIM

INCHES

0.51

0.15 SQ

0.71

0.020

0.006 SQ

0.028

0.99

0.039

0.51

0.020

NOTES:

DIE

SOLDER

BUMP

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad

and outline: .xxx 0.05mm ( 0.002”).

3. Preferred: Using 0.1mm (0.004”) stencil.

H G

TAPE & REEL ORIENTATION

SOLDER PADS

SOLDER PRINT

0.010 - 0.012 DIA.

Laser

Orientation

Line

SOLDER MASK

Dual Die - 0404

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

Outline & Dimensions: Rev 4 - 9/04, 06022

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and reeled in accordance with EIA 481.

2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., P0404FC05C-T75-1.

3. 8mm Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2, i.e., P0404FC05C-T710-2.

4. Suffix - LF = Lead-Free, i.e., P0404FC05C-LF-T710-2.

ProTek Devices

2929 South Fair Lane, Tempe,AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@protekdevices.com

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s

and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

Web Site: www.protekdevices.com

05154.R6 2/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”

1...3 4 56

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