P
www.vishay.com
POPULAR OPTIONS
Vishay Sfernice
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film) www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/1505/2010).
DIMENSIONS (Option 0063) in millimeters
Bottom view for mounting
Uncoatted
ceramic
A
Enlarged
termination
B
F
D
E
A
B
E
D
MAX0 TOL0
+ ꢀ0152
MIN0 TOL0
- ꢀ0152
MAX0 TOL0
+ ꢀ0127
MIN0 TOL0
- ꢀ0127
MAX0 TOL0
+ ꢀ013
MIN0 TOL0
- ꢀ013
MAX0 TOL0
+ ꢀ013
MIN0 TOL0
- ꢀ013
F
CASE SIZE
NOMINAL
3.06
NOMINAL
1.60
NOMINAL
NOMINAL
1.215
NOMINAL
MIN0
MAX0
1206
1505
2010
0.40
3.81
1.32
1.59
0.63
0.50
0.76
0.48
5.08
2.54
2.25
Note
Case size 2512 under development. Please consult Vishay Sfernice.
•
SUGGESTED LAND PATTERN (Option 0063)
Gmin.
Xmax.
Zmax.
DIMENSIONS (IN MILLIMETER)
Gmin0
CHIP SIZE
Zmax0
Xmax0
1.73
1.45
2.67
1206
1505
2010
3.91
4.66
5.93
0.50
Note
Case size 2512 under development. Please consult Vishay Sfernice.
•
Revision: 08-Sep-11
Document Number: 53017
4
For technical questions, contact: sfer@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000