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OMAP3530ECBB PDF预览

OMAP3530ECBB

更新时间: 2024-02-24 09:23:26
品牌 Logo 应用领域
德州仪器 - TI 外围集成电路
页数 文件大小 规格书
239页 3505K
描述
应用处理器 | CBB | 515 | 0 to 90

OMAP3530ECBB 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:LFBGA, BGA423,24X24,25
针数:423Reach Compliance Code:compliant
HTS代码:8542.31.00.01Factory Lead Time:1 week
风险等级:2.24JESD-30 代码:S-PBGA-B423
JESD-609代码:e1长度:16 mm
湿度敏感等级:4端子数量:423
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA423,24X24,25封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.1,1.2,1.8,1.8/3 V认证状态:Not Qualified
座面最大高度:1.4 mm子类别:Graphics Processors
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.65 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:16 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

OMAP3530ECBB 数据手册

 浏览型号OMAP3530ECBB的Datasheet PDF文件第233页浏览型号OMAP3530ECBB的Datasheet PDF文件第234页浏览型号OMAP3530ECBB的Datasheet PDF文件第235页浏览型号OMAP3530ECBB的Datasheet PDF文件第236页浏览型号OMAP3530ECBB的Datasheet PDF文件第237页浏览型号OMAP3530ECBB的Datasheet PDF文件第238页 
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