DATA SHEET
www.onsemi.com
MOSFET – Power, Single
N-Channel
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
40 V
12 mꢂ @ 10 V
35 A
40 V, 12 mW, 35 A
D (5,6)
NVMFS5C468N
Features
G (4)
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Q and Capacitance to Minimize Driver Losses
DS(on)
S (1,2,3)
N−CHANNEL MOSFET
G
• NVMFS5C468NWF − Wettable Flank Option for Enhanced Optical
Inspection
• AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
DFNW5 5x6
(FULL−CUT SO8FL WF)
CASE 507BA
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
35
A
C
D
MARKING DIAGRAM
ꢀ
JC
T
C
25
(Notes 1, 3)
Steady
State
1
Power Dissipation
T
C
P
28
W
A
D
XXXXXX
AYWZZ
R
(Note 1)
ꢀ
JC
T
C
= 100°C
14
Continuous Drain
Current R
T = 25°C
A
I
D
12
ꢀ
JA
XXXXXX = Specific Device Code
T = 100°C
A
8.7
3.5
1.7
151
(Notes 1, 2, 3)
Steady
State
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1 & 2)
ꢀ
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ꢁ s
I
DM
A
A
p
Operating Junction and Storage Temperature
T , T
−55 to
+ 175
°C
J
stg
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Source Current (Body Diode)
I
23
75
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 1.9 A)
L(pk)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
5.3
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
ꢀ
JC
R
43
ꢀ
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
April, 2022 − Rev. 1
NVMFS5C468N/D