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NTMFS4852N PDF预览

NTMFS4852N

更新时间: 2024-09-24 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 136K
描述
Power MOSFET 30 V, 155 A, Single N−Channel, SO−8 FL

NTMFS4852N 数据手册

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NTMFS4852N  
Advance Information  
Power MOSFET  
30 V, 155 A, Single NChannel, SO8 FL  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
These are PbFree Device  
http://onsemi.com  
V
R
DS(ON)  
MAX  
I MAX  
D
Applications  
(BR)DSS  
Refer to Application Note AND8195/D  
CPU Power Delivery  
DCDC Converters  
2.1 mW @ 10 V  
3.1 mW @ 4.5 V  
30 V  
155 A  
Low Side Switching  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
D (5,6)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
V
GS  
20  
V
G (4)  
Continuous Drain  
Current R  
T = 25°C  
I
D
25  
A
A
q
JA  
T = 85°C  
A
18  
(Note 1)  
Power Dissipation  
(Note 1)  
S (1,2,3)  
NCHANNEL MOSFET  
T = 25°C  
A
P
2.31  
W
A
D
D
D
D
R
q
JA  
Continuous Drain  
T = 25°C  
A
I
40  
29  
D
Current R  
10 sec  
v
q
JA  
MARKING  
DIAGRAM  
T = 85°C  
A
Power Dissipation  
T = 25°C  
A
P
5.95  
W
A
D
R
t v 10 sec  
q
JA,  
Steady  
State  
S
S
S
G
D
D
Continuous Drain  
Current R  
T = 25°C  
A
I
16  
11  
D
1
4852N  
AYWWG  
G
q
JA  
T = 85°C  
A
SO8 FLAT LEAD  
CASE 488AA  
STYLE 1  
(Note 2)  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
0.90  
W
A
D
R
q
JA  
Continuous Drain  
Current R  
T
T
T
= 25°C  
= 85°C  
= 25°C  
I
155  
112  
C
C
C
D
A
Y
= Assembly Location  
= Year  
= Work Week  
q
JC  
(Note 1)  
Power Dissipation  
(Note 1)  
WW  
G
P
86.2  
W
A
= PbFree Package  
R
q
JC  
(Note: Microdot may be in either location)  
Pulsed Drain  
Current  
t =10ms  
p
T = 25°C  
A
I
DM  
310  
100  
Current limited by package  
T = 25°C  
A
I
A
ORDERING INFORMATION  
Dmaxpkg  
Operating Junction and Storage  
Temperature  
T ,  
STG  
55 to  
+150  
°C  
J
Device  
Package  
Shipping  
T
NTMFS4852NT1G  
SO8FL  
(PbFree)  
1500 /  
Tape & Reel  
Source Current (Body Diode)  
Drain to Source dV/dt  
I
72  
6
A
S
dV/dt  
EAS  
V/ns  
mJ  
NTMFS4852NT3G  
SO8FL  
(PbFree)  
5000 /  
Tape & Reel  
Single Pulse DraintoSource Avalanche  
Energy (V = 50 V, V = 10 V,  
360  
DD  
GS  
I = 49 A , L = 0.3 mH, R = 25 W)  
L
pk  
G
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
This document contains information on a new product. Specifications and information  
herein are subject to change without notice.  
*For additional information on our PbFree strategy  
and soldering details, please download the ON  
Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
July, 2009 Rev. P1  
NTMFS4852N/D  

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