NTMFS4852N
Advance Information
Power MOSFET
30 V, 155 A, Single N−Channel, SO−8 FL
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Device
http://onsemi.com
V
R
DS(ON)
MAX
I MAX
D
Applications
(BR)DSS
• Refer to Application Note AND8195/D
• CPU Power Delivery
• DC−DC Converters
2.1 mW @ 10 V
3.1 mW @ 4.5 V
30 V
155 A
• Low Side Switching
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
D (5,6)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
30
Unit
V
V
DSS
V
GS
20
V
G (4)
Continuous Drain
Current R
T = 25°C
I
D
25
A
A
q
JA
T = 85°C
A
18
(Note 1)
Power Dissipation
(Note 1)
S (1,2,3)
N−CHANNEL MOSFET
T = 25°C
A
P
2.31
W
A
D
D
D
D
R
q
JA
Continuous Drain
T = 25°C
A
I
40
29
D
Current R
10 sec
v
q
JA
MARKING
DIAGRAM
T = 85°C
A
Power Dissipation
T = 25°C
A
P
5.95
W
A
D
R
t v 10 sec
q
JA,
Steady
State
S
S
S
G
D
D
Continuous Drain
Current R
T = 25°C
A
I
16
11
D
1
4852N
AYWWG
G
q
JA
T = 85°C
A
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
(Note 2)
Power Dissipation
(Note 2)
T = 25°C
A
P
0.90
W
A
D
R
q
JA
Continuous Drain
Current R
T
T
T
= 25°C
= 85°C
= 25°C
I
155
112
C
C
C
D
A
Y
= Assembly Location
= Year
= Work Week
q
JC
(Note 1)
Power Dissipation
(Note 1)
WW
G
P
86.2
W
A
= Pb−Free Package
R
q
JC
(Note: Microdot may be in either location)
Pulsed Drain
Current
t =10ms
p
T = 25°C
A
I
DM
310
100
Current limited by package
T = 25°C
A
I
A
ORDERING INFORMATION
Dmaxpkg
Operating Junction and Storage
Temperature
T ,
STG
−55 to
+150
°C
J
†
Device
Package
Shipping
T
NTMFS4852NT1G
SO−8FL
(Pb−Free)
1500 /
Tape & Reel
Source Current (Body Diode)
Drain to Source dV/dt
I
72
6
A
S
dV/dt
EAS
V/ns
mJ
NTMFS4852NT3G
SO−8FL
(Pb−Free)
5000 /
Tape & Reel
Single Pulse Drain−to−Source Avalanche
Energy (V = 50 V, V = 10 V,
360
DD
GS
I = 49 A , L = 0.3 mH, R = 25 W)
L
pk
G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
*For additional information on our Pb−Free strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
July, 2009 − Rev. P1
NTMFS4852N/D