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NT512D64S8HB0G PDF预览

NT512D64S8HB0G

更新时间: 2024-02-21 07:27:05
品牌 Logo 应用领域
其他 - ETC 双倍数据速率
页数 文件大小 规格书
28页 358K
描述
184 pin Unbuffered DDR DIMM

NT512D64S8HB0G 数据手册

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NT512D64S8HB1G / NT512D64S8HB1GY / NT512D64S8HB0G  
NT256D64S88B1G / NT256D64S88B1GY NT256D64S88B0G  
NT128D64SH4B1G / NT512D72S8PB0G (ECC) / NT256D72S89B0G (ECC)  
512MB, 256MB and 128MB  
PC3200, PC2700 and PC2100  
Unbuffered DDR DIMM  
184 pin Unbuffered DDR DIMM  
Based on DDR400/333/266 256M bit B Die device  
Features  
• 184 Dual In-Line Memory Module (DIMM)  
• Unbuffered DDR DIMM based on 256M bit die B device,  
organized as either 32Mbx8 or 16Mbx16  
• Performance:  
• DRAM DLL aligns DQ and DQS transitions with clock transitions  
• Address and control signals are fully synchronous to positive  
clock edge  
• Programmable Operation:  
- DIMM CAS Latency: 2, 2.5, 3  
PC3200 PC2700 PC2100  
- Burst Type: Sequential or Interleave  
- Burst Length: 2, 4, 8  
Unit  
Speed Sort  
5T  
3
6K  
2.5  
166  
6
75B  
2.5  
DIMM CAS Latency  
fCK Clock Frequency  
tCK Clock Cycle  
- Operation: Burst Read and Write  
• Auto Refresh (CBR) and Self Refresh Modes  
• Automatic and controlled precharge commands  
• 7.8 µs Max. Average Periodic Refresh Interval  
• Serial Presence Detect EEPROM  
• Gold contacts  
200  
5
133  
7.5  
MHz  
ns  
fDQ DQ Burst Frequency  
400  
333  
266  
MHz  
• Intended for 133, 166 and 200 MHz applications  
• Inputs and outputs are SSTL-2 compatible  
• VDD = VDDQ = 2.5V ± 0.2V (2.6V ± 0.1V for PC3200)  
• SDRAMs have 4 internal banks for concurrent operation  
• Differential clock inputs  
• SDRAMs are packaged in TSOP packages  
• “Green” packaging – lead free  
• Data is read or written on both clock edges  
Description  
NT512D64S8HB0G, NT512D64S8HB1G, NT512D64S8HB1GY, NT512D72S8PB0G, NT256D64SH88B0G, NT256D64SH88B1G,  
NT256D64SH88B1GY, NT256D72S89B0G and NT128D64SH4B1G are unbuffered 184-Pin Double Data Rate (DDR) Synchronous DRAM  
Dual In-Line Memory Modules (DIMM). NT512D64S8HB1GY and NT256D64SH88B1GY are packaged using lead free technology.  
NT512D64S8HB0G, NT512D64S8HB1G and NT512D64S8HB1GY are 512MB modules organized as dual ranks using sixteen 32Mx8  
TSOP devices. NT512D72S8PB0G has ECC and is organized as dual ranks using eighteen 32Mx8 TSOP devices. NT256D64SH88B0G,  
NT256D64SH88B1G and NT256D64SH88B1GY are 256MB modules organized as single rank using eight 32Mx8 TSOP devices.  
NT256D72S89B0G has ECC and is organized as single rank using nine 32Mx8 TSOP devices. NT128D64SH4B1G are 128MB modules,  
organized as single rank using four 16Mx16 TSOP devices.  
Depending on the speed grade, these DIMMs are intended for use in applications operating up to 200 MHz clock speeds and achieves  
high-speed data transfer rates of up to 400 MHz. Prior to any access operation, the device CAS latency and burst type/ length/operation  
type must be programmed into the DIMM by address inputs and I/O inputs BA0 and BA1 using the mode register set cycle.  
The DIMM uses a serial EEPROM and through the use of a standard IIC protocol the serial presence-detect implementation (SPD) can be  
accessed. The first 128 bytes of the SPD data are programmed with the module characteristics as defined by JEDEC.  
REV 2.2  
Aug 3, 2004  
Preliminary  
1
© NANYA TECHNOLOGY CORPORATION  
NANYA reserves the right to change products and specifications without notice.  

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