Datasheet > NP284-26409N

NP284-26409N

更新时间： 2024-02-17 20:49:31

品牌	Logo	应用领域
YAMAICHI		/
页数	文件大小	规格书
1页	78K
描述
Chip Scale Package (CSP, 0.50mm Pitch)

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中文翻译

获取价格

数据手册

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NP284-26409N 数据手册

NP284 Series (Open Top)

Chip Scale Package (CSP, 0.50mm Pitch)

Specifications

Part Number(Details)

1,000M min. at 100V DC

Dielectric Withstanding Voltage:100V AC for 1 minute

Insulation Resistance:

NP284

Series No.

264 09 *

Contact Resistance:

30m max. at 10mA/20mV max.

Operating Temperature Range: –40°C to +150°C

No. of Contact Pins

Design Number

11gf per pin approx.

35 x 35

Contact Force:

Grid Size:

264 pins

Pin Count:

Positioning Pin: N = Without

P = With

Materials and Finish

Housing:

Polyetherimide (PEI), glass-filled

Polyetherssulphone (PES), glass-filled

Contacts:

Plating:

Beryllium Copper (BeCu)

Gold over Nickel

Features

í Open top type socket for CSP packages with 0.50mm pitch

í Self contacting structure without upper pressing force (ZIF)

í Fan-out Terminal type, designed to reduce ball damage

Contact Details (Section C - C)

Outline Socket Dimensions

0.30

0.15

50.00

46.00

22.00

18.15^+0.1

8.50 0.1

8.50

'B'

Pos. pin

Detail 'B'

20.15

0.5x34=17.00 0.15

0.50 0.1

Æ3.20 Thru hole

1.50

15.65 ^-0.1

17.35 ^+0.1

8.50 0.1

Æ6.00

Recommended PC Board Layout

Matching IC Dimensions

Top View from Socket

42.25 0.05

38.25 0.05

34.25 0.05

27.25 0.05

23.25 0.05

19.25 0.05

8.50 0.05

4 - Æ2.70 ^+0.1Thru hole

for pos. pin

Æ3.20^+0.1

Thru hole

0.50

0.50x34=17.00

264 - Æ0.45⁺⁰^0.1

264 - Æ0.30

Test & Burn-In

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER

中文翻译

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