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N24C32UDTG PDF预览

N24C32UDTG

更新时间: 2024-09-24 01:14:07
品牌 Logo 应用领域
安森美 - ONSEMI 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
页数 文件大小 规格书
10页 89K
描述
32 Kb I2C CMOS Serial EEPROM

N24C32UDTG 数据手册

 浏览型号N24C32UDTG的Datasheet PDF文件第2页浏览型号N24C32UDTG的Datasheet PDF文件第3页浏览型号N24C32UDTG的Datasheet PDF文件第4页浏览型号N24C32UDTG的Datasheet PDF文件第5页浏览型号N24C32UDTG的Datasheet PDF文件第6页浏览型号N24C32UDTG的Datasheet PDF文件第7页 
N24C32  
32 Kb I2C CMOS Serial  
EEPROM  
Description  
The N24C32 is a 32 Kb CMOS Serial EEPROM device, organized  
internally as 128 pages of 32 bytes each. This device supports the  
Standard (100 kHz), Fast (400 kHz) and Fast−Plus (1 MHz) I C  
www.onsemi.com  
2
protocol.  
Data is written by providing a starting address, then loading 1 to 32  
contiguous bytes into a Page Write Buffer, and then writing all data to  
non−volatile memory in one internal write cycle. Data is read by  
providing a starting address and then shifting out data serially while  
automatically incrementing the internal address count.  
External address pins make it possible to address up to eight  
N24C32 devices on the same bus.  
US8  
U SUFFIX  
CASE 493  
PIN CONFIGURATIONS  
1
V
A
A
A
CC  
0
1
2
WP  
Features  
SCL  
SDA  
V
SS  
2
Supports Standard, Fast and Fast−Plus I C Protocol  
US8 (U)  
(Top View)  
1.7 V / 1.6 V to 5.5 V Supply Voltage Range  
32−Byte Page Write Buffer  
Fast Write Time (4 ms max)  
MARKING DIAGRAM  
Hardware Write Protection for Entire Memory  
8
2
Schmitt Triggers and Noise Suppression Filters on I C Bus Inputs  
(SCL and SDA)  
XX MG  
Low Power CMOS Technology  
1,000,000 Program/Erase Cycles  
100 Year Data Retention  
G
1
Industrial and Automotive Grade 1 Temperature Range  
US 8−lead Package  
XX  
M
G
= Specific Device Code*  
= Date Code  
= Pb−Free Package  
These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS  
Compliant  
(Note: Microdot may be in either location)  
* See Ordering Information section for the  
Specific Device Marking Code  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 10 of this data sheet.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
June, 2016 − Rev. 1  
N24C32/D  

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