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MZP4730ATA PDF预览

MZP4730ATA

更新时间: 2024-02-12 22:19:40
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 测试二极管
页数 文件大小 规格书
10页 156K
描述
3.9V, 3W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-41

MZP4730ATA 技术参数

生命周期:Obsolete包装说明:O-PALF-W2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.84
外壳连接:ISOLATED配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JEDEC-95代码:DO-41JESD-30 代码:O-PALF-W2
膝阻抗最大值:400 Ω元件数量:1
端子数量:2最高工作温度:200 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
极性:UNIDIRECTIONAL最大功率耗散:3 W
认证状态:Not Qualified标称参考电压:3.9 V
最大反向电流:50 µA表面贴装:NO
技术:ZENER端子形式:WIRE
端子位置:AXIAL最大电压容差:5%
工作测试电流:64 mABase Number Matches:1

MZP4730ATA 数据手册

 浏览型号MZP4730ATA的Datasheet PDF文件第1页浏览型号MZP4730ATA的Datasheet PDF文件第3页浏览型号MZP4730ATA的Datasheet PDF文件第4页浏览型号MZP4730ATA的Datasheet PDF文件第5页浏览型号MZP4730ATA的Datasheet PDF文件第6页浏览型号MZP4730ATA的Datasheet PDF文件第7页 
GENERAL DATA — 1-3 WATT DO-41 SURMETIC 30  
30  
20  
D =0.5  
0.2  
10  
7
5
0.1  
3
2
t
P
1
PK  
0.05  
t
2
DUTY CYCLE, D =t /t  
0.02  
0.01  
1 2  
1
0.7  
0.5  
NOTE: BELOW 0.1 SECOND, THERMAL  
RESPONSE CURVE IS APPLICABLE  
TO ANY LEAD LENGTH (L).  
SINGLE PULSE  
T
=
θ
T
(t)P  
JL  
JL  
JL  
PK  
REPETITIVE PULSES  
=
θ
(t,D)P  
D = 0  
JL  
PK  
0.3  
0.0001 0.0002  
0.0005  
0.001  
0.002  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
1
2
5
10  
t, TIME (SECONDS)  
Figure 2. Typical Thermal Response L, Lead Length = 3/8 Inch  
3
1K  
2
RECTANGULAR  
NONREPETITIVE  
1
0.5  
500  
T = 125°C  
A
WAVEFORM  
300  
200  
T
= 25°C PRIOR  
J
0.2  
0.1  
TO INITIAL PULSE  
0.05  
100  
0.02  
0.01  
0.005  
50  
30  
20  
T
= 125°C  
0.002  
0.001  
A
0.0005  
0.0003  
10  
1
2
5
10  
20  
50  
100 200  
400  
1000  
0.1  
0.2 0.3 0.5  
1
2
3
5
10  
20 30 50 100  
NOMINAL V (VOLTS)  
Z
PW, PULSE WIDTH (ms)  
Figure 3. Maximum Surge Power  
Figure 4. Typical Reverse Leakage  
APPLICATION NOTE  
Since the actual voltage available from a given zener diode  
is temperature dependent, it is necessary to determine junc-  
tiontemperatureunderanysetofoperatingconditionsinorder  
to calculate its value. The following procedure is recom-  
mended:  
T is the increase in junction temperature above the lead  
temperature and may be found from Figure 2 for a train of  
power pulses (L = 3/8 inch) or from Figure 10 for dc power.  
JL  
T = θ  
JL  
P
D
JL  
For worst-case design, using expected limits of I , limits of  
Z
Lead Temperature, T , should be determined from:  
L
P
and the extremes of T (T ) may be estimated. Changes  
D
J J  
T = θ  
L
P
D
+ T  
A
LA  
in voltage, V , can then be found from:  
Z
θ
P
is the lead-to-ambient thermal resistance (°C/W) and  
LA  
D
V = θ  
T  
J
VZ  
is the power dissipation. The value for θ will vary and  
LA  
LA  
depends on the device mounting method. θ  
30–40°C/W for the various clips and tie points in common  
is generally  
θ
,thezenervoltagetemperaturecoefficient,isfoundfrom  
VZ  
Figures 5 and 6.  
use and for printed circuit board wiring.  
Under high power-pulse operation, the zener voltage will  
vary with time and may also be affected significantly by the  
zenerresistance. Forbestregulation, keepcurrentexcursions  
as low as possible.  
Data of Figure 2 should not be used to compute surge capa-  
bility. Surge limitations are given in Figure 3. They are lower  
than would be expected by considering only junction tempera-  
ture, as current crowding effects cause temperatures to be ex-  
tremely high in small spots resulting in device degradation  
should the limits of Figure 3 be exceeded.  
The temperature of the lead can also be measured using a  
thermocoupleplacedontheleadascloseaspossibletothetie  
point. The thermal mass connected to the tie point is normally  
large enough so that it will not significantly respond to heat  
surges generated in the diode as a result of pulsed operation  
once steady-state conditions are achieved. Using the mea-  
sured value of T , the junction temperature may be deter-  
L
mined by:  
T = T + T  
JL  
J
L
Motorola TVS/Zener Device Data  
1–3 Watt DO-41 Surmetic 30 Data Sheet  
6-44  

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