MUR220
Preferred Device
SWITCHMODEt
Power Rectifier
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
http://onsemi.com
• Ultrafast 25 Nanosecond Recovery Times
• 175°C Operating Junction Temperature
• Low Forward Voltage
ULTRAFAST RECTIFIER
2.0 AMPERES − 200 VOLTS
• Low Leakage Current
• High Temperature Glass Passivated Junction
• These are Pb−Free Devices*
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
AXIAL LEAD
CASE 059−10
PLASTIC
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Cathode Indicated by Polarity Band
MAXIMUM RATINGS
MARKING DIAGRAM
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
200
−
V
RRM
V
RWM
V
A
R
MUR220
YYWW G
G
Average Rectified Forward Current (Note 1)
(Square Wave Mounting Method #3 Per Note 3)
I
2.0 @
T = 90°C
A
A
F(AV)
A
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
I
35
FSM
A
= Assembly Location
MUR220 = Device Code
YY
WW
G
= Year
= Work Week
= Pb−Free Package
Operating Junction Temperature and Storage T , T
Temperature Range
− 65 to
+175
°C
J
stg
THERMAL CHARACTERISTICS
Characteristic
(Note: Microdot may be in either location)
Symbol
Max
Unit
ORDERING INFORMATION
Thermal Resistance, Junction−to−Ambient
R
q
JA
(Note 3) °C/W
†
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
Device
MUR220
Package
Axial Lead**
Axial Lead**
Shipping
1000 Units / Bulk
1000 Units / Bulk
MUR220G
MUR220RL
MUR220RLG
Axial Lead** 5000 / Tape & Reel
Axial Lead** 5000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
**This package is inherently Pb−Free.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
July, 2006 − Rev. 7
MUR220/D