CHIP RESISTOR
电阻温度系数 T.C.R
标称阻值允许偏差 Resistance Tolerance
2%
( )
ppm/℃
阻值范围
Resistance Range
型 号
Type
(
m
1
Ω)
±
1%
±
±
5%
±150
±
150
±
150
0306
0612
±100
±100
±100
1
≤R≤10
项目
标 准
测试方法 (IEC60115-1)
Item
Specifications
Test Methods (IEC60115-1)
IEC 60115-1 4.17
245℃±5℃锡槽,保持3s±0.3s.
Lead-free solder bath at 245℃±5℃ for 3s±0.3s.
可焊性
Solderability
可焊面积≥95%
95% Cover Min
耐焊接热
IEC 60115-1 4.18
无可见损伤
Resistance to
Soldering Heat
No mechanical damage
270℃±5℃锡槽,保持10s±1s.
Lead-free solder bath at 270℃±5℃ for 10s±1s.
△R≤±1.0%R
IEC 60115-1 4.33
弯曲距离(Bending distance)
保持时间(Duration):60s±5s.
基板弯曲试验
Substrate
Bending Test
无可见损伤
No mechanical damage
△R≤±1.0%R
:3mm
在规定值内
Within specified T.C.R
IEC 60115-1 4.8
+20℃/+125℃/+20℃
电阻温度系数
T.C.R
IEC 60115-1 4.19
无可见损伤
No mechanical damage
温度快速变化
-55℃(30分钟)~常温(5分钟)~125℃(30分钟) 100个循环。
-55 (30min) normal temperature(5min) 125 (30min)
100 cycles.
Rapid Change of
Temperature
℃
~
~
℃
△
R
≤±1.0%R
无可见损伤
IEC 60115-1 4.13
2.5倍额定功率,保持5秒。
2.5×Rated Power,for 5 s.
短时间过负载
Short Time Overload
No mechanical damage
≤±1.0%R
△
R
IEC 60115-1 4.24
40℃±2℃,93%±3%RH,1000小时 ,额定电压或元件极限电压(取较小值),
No mechanical damage 通1.5小时/断0.5小时。
无可见损伤
稳态湿热
Damp Heat,
Steady State
△
R
≤±1.0%R
40℃±2℃,93%±3%RH,1000h,rated voltage or limiting element voltage
whichever is lower for 1.5h ON/0.5h OFF.
IEC 60115-1 4.25.1
70℃±2℃,1000小时,额定电流或元件极限电流(取最小值),
通1.5小时/断0.5小时。
70℃±2℃,1000h,rated current or limiting element current
无可见损伤
No mechanical damage
70℃耐久性
Endurance at 70℃
△R≤± 1.0%R
whichever is lower for 1.5h ON/0.5h OFF.
上限类别温度耐久性
Endurance at Upper
Category Temperature
无可见损伤
No mechanical damage
≤± 1.0%R
IEC 60115-1 4.25.3
170℃±2℃,1000h
△R
3