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MTB75N05HDT4G PDF预览

MTB75N05HDT4G

更新时间: 2024-02-03 19:10:17
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安森美 - ONSEMI /
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MTB75N05HDT4G 数据手册

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MTB75N05HD  
POWER MOSFET SWITCHING  
Switching behavior is most easily modeled and predicted  
by recognizing that the power MOSFET is charge  
controlled. The lengths of various switching intervals (t)  
are determined by how fast the FET input capacitance can  
be charged by current from the generator.  
The published capacitance data is difficult to use for  
calculating rise and fall because drain–gate capacitance  
varies greatly with applied voltage. Accordingly, gate  
charge data is used. In most cases, a satisfactory estimate of  
The capacitance (C ) is read from the capacitance curve at  
a voltage corresponding to the off–state condition when  
iss  
calculating t  
and is read at a voltage corresponding to the  
on–state when calculating t  
d(on)  
.
d(off)  
At high switching speeds, parasitic circuit elements  
complicate the analysis. The inductance of the MOSFET  
source lead, inside the package and in the circuit wiring  
which is common to both the drain and gate current paths,  
produces a voltage at the source which reduces the gate drive  
current. The voltage is determined by Ldi/dt, but since di/dt  
is a function of drain current, the mathematical solution is  
complex. The MOSFET output capacitance also  
complicates the mathematics. And finally, MOSFETs have  
finite internal gate resistance which effectively adds to the  
resistance of the driving source, but the internal resistance  
is difficult to measure and, consequently, is not specified.  
The resistive switching time variation versus gate  
resistance (Figure 9) shows how typical switching  
performance is affected by the parasitic circuit elements. If  
the parasitics were not present, the slope of the curves would  
maintain a value of unity regardless of the switching speed.  
The circuit used to obtain the data is constructed to minimize  
common inductance in the drain and gate circuit loops and  
is believed readily achievable with board–mounted  
components. Most power electronic loads are inductive; the  
data in the figure is taken with a resistive load, which  
approximates an optimally snubbed inductive load. Power  
MOSFETs may be safely operated into an inductive load;  
however, snubbing reduces switching losses.  
average input current (I  
) can be made from a  
G(AV)  
rudimentary analysis of the drive circuit so that  
t = Q/I  
G(AV)  
During the rise and fall time interval when switching a  
resistive load, V remains virtually constant at a level  
GS  
known as the plateau voltage, V  
. Therefore, rise and fall  
SGP  
times may be approximated by the following:  
t = Q x R /(V  
– V )  
GSP  
r
2
G
GG  
t = Q x R /V  
f
2
G
GSP  
where  
V
= the gate drive voltage, which varies from zero to V  
GG  
= the gate drive resistance  
GG  
R
G
and Q and V  
are read from the gate charge curve.  
2
GSP  
During the turn–on and turn–off delay times, gate current is  
not constant. The simplest calculation uses appropriate  
values from the capacitance curves in a standard equation for  
voltage change in a RC network. The equations are:  
t
t
= R  
= R  
C
C
In [V /(V  
In (V /V  
iss GG GSP  
– V )]  
GSP  
)
d(on)  
d(off)  
G
G
iss  
GG GG  
8000  
7000  
6000  
V
= 0  
V
GS  
= 0  
DS  
T = 25°C  
J
C
iss  
5000  
4000  
C
C
iss  
C
rss  
3000  
2000  
oss  
C
rss  
1000  
0
10  
5
0
5
10  
15  
20  
25  
V
GS  
V
DS  
GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS)  
Figure 7. Capacitance Variation  
http://onsemi.com  
4

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