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MT58L256L18F1B-6.8 PDF预览

MT58L256L18F1B-6.8

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
31页 349K
描述
Standard SRAM, 256KX18, 6.8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

MT58L256L18F1B-6.8 数据手册

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4Mb : 256K x 18, 128K x 32/36  
FLOW-THROUGH SYNCBURST SRAM  
FBGA PIN DESCRIPTIONS  
x18  
x32/x36  
SYMBOL TYPE  
DESCRIPTION  
6R  
6P  
6R  
6P  
SA0  
SA1  
SA  
Input Synchronous Address Inputs: These inputs are registered and must  
meet the setup and hold times around the rising edge of CLK.  
2A, 2B, 3P,  
3R, 4P, 4R,  
2A, 2B, 3P,  
3R, 4P, 4R,  
8P, 8R, 9P, 9R, 8P, 8R, 9P,  
10A, 10B, 10P, 9R, 10A, 10B,  
10R, 11A, 11R 10P, 10R, 11R  
5B  
4A  
5B  
5A  
4A  
4B  
BWa#  
BWb#  
BWc#  
BWd#  
Input Synchronous Byte Write Enables: These active LOW inputs allow  
individual bytes to be written and must meet the setup and hold  
times around the rising edge of CLK. A byte write enable is LOW  
for a WRITE cycle and HIGH for a READ cycle. For the x18 version,  
BWa# controls DQas and DQPa; BWb# controls DQbs and DQPb. For  
the x32 and x36 versions, BWa# controls DQas and DQPa; BWb#  
controls DQbs and DQPb; BWc# controls DQcs and DQPc; BWd#  
controls DQds and DQPd. Parity is only available on the x18 and x36  
versions.  
7A  
7B  
6B  
7A  
7B  
6B  
BWE#  
GW#  
CLK  
Input Byte Write Enable: This active LOW input permits BYTE WRITE  
operations and must meet the setup and hold times around the  
rising edge of CLK.  
Input Global Write: This active LOW input allows a full 18-, 32-, or 36-bit  
WRITE to occur independent of the BWE# and BWx# lines and must  
meet the setup and hold times around the rising edge of CLK.  
Input Clock: This signal registers the address, data, chip enable, byte write  
enables, and burst control inputs on its rising edge. All synchronous  
inputs must meet setup and hold times around the clocks rising  
edge.  
3A  
6A  
3A  
6A  
CE#  
CE2#  
ZZ  
Input Synchronous Chip Enable: This active LOW input is used to enable  
the device and conditions the internal use of ADSP#. CE# is sampled  
only when a new external address is loaded.  
Input Synchronous Chip Enable: This active LOW input is used to enable  
the device and is sampled only when a new external address is  
loaded.  
11H  
11H  
Input Snooze Enable: This active HIGH, asynchronous input causes the  
device to enter a low-power standby mode in which all data in the  
memory array is retained. When ZZ is active, all other inputs are  
ignored.  
3B  
3B  
CE2  
Input Synchronous Chip Enable: This active HIGH input is used to enable  
the device and is sampled only when a new external address is  
loaded.  
8B  
9A  
8B  
9A  
OE#(G#)  
ADV#  
Input Output Enable: This active LOW, asynchronous input enables the  
data I/O output drivers.  
Input Synchronous Address Advance: This active LOW input is used to  
advance the internal burst counter, controlling burst access after the  
external address is loaded. A HIGH on ADV# effectively causes wait  
states to be generated (no address advance). To ensure use of  
correct address during a WRITE cycle, ADV# must be HIGH at the  
rising edge of the first clock after an ADSP# cycle is initiated.  
(continued on next page)  
4Mb: 256K x 18, 128K x 32/36 Flow-Through SyncBurst SRAM  
Micron Technology, Inc., reservesthe right to change productsor specificationswithout notice.  
8
MT58L256L18F1_D.p65 Rev. 10/01  
©2001, Micron Technology, Inc.  

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